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ROGERS PCB APPLICATIONS

Rogers 4350B

The Rogers 4350B has a low loss capability and stable control on its dielectric constant (DK), makes its materials ideal for high power RF designs and super-active appliances.

Rogers 3003

This Rogers PCB model is suitable for automotive radar applications with 77 GHz, and it also supports 5G wireless applications and ADAS.

Rogers 3006

The 3006 model offers excellent mechanical and electrical stability—with a reliable dielectric constant across various temperatures. And it removes the step change in the Dk.

Rogers 3010

The 3010 is one of the most affordable models with advanced ceramic-filled PTFE materials. Hence, its stability streamlines the broadband components.

Rogers 0588

Reinforced with glass microfibers, the Rogers 5880 has a low DK and loss feature. Hence, it makes the model highly suitable for broadband and high-frequency applications.

Rogers 6002

The 6002 model comes with low DK materials that are ideal for sophisticated microwave structures. Hence, it’s ideal for multi-layer board designs.

Rogers 6010

This RO6010 is ideal for microwave and electronic board applications that require a high DK. Also, the model is ideal—if you plan on dealing with circuit size reduction.

Rogers 4003

The Rogers 4003 model uses 1674 and 1080 glass fabric styles. All its configurations have the same specifications; they don’t support bromination.

Rogers 4835

This 4835 laminate is a low-loss material that provides high stability at significant oxidation resistance and increased temperatures. With it, you’ll get a standard glass or epoxy FR-4 processes and cheap circuit production.

Rogers 4360G2

This laminate offers a perfect balance of processing capability and performance. Plus, the low-loss laminate consists of hydrocarbon ceramic-filled thermostat materials.

Data Sheet Showing the Different Roger PCB Models (Table 1)

Property RO4350B RO3003 RO3006 RO3010 RO4835 RO5880 RO6002 RO6010 RO4003 RO 4360G2
Dk, Process (2)3.48 ± 0.05 3.00 ± 0.04 6.15 ± 0.15 10.2 ± 0.30 3.48 ± 0.05 2.20 ± 0.02 2.94 ± 0.04 10.2 ± 0.25 3.38 ± 0.05 6.15 ± 0.15
Dk Design 3.66 3.00 6.50 11.20 3.66 2.20 2.94 3.55
Dissipation Factor 0.0037 0.0031 0.001 0 0.002 0 0.002 2 0.003 7 0.0004 0.0009 0.001 2 0.002 3 0.0027 0.0021 0.003 8
Thermal Coefficient +50 -3 -262 -395 +50 -125 +12 -425 +40
Dimension Stability -0.06 0.07 -0.27 -0.15 -0.35 -0.31
Volume Resistivity 1.2 X 10^10 10^7 10^5 10^5 5 x 10^8 2 x 10^7 10^6 5 x 10^5 1.7 X 10^10 4.0 x 10^13
Surface Resistivity 5.7 X 10^9 10^7 10^5 10^5 7 x 10^8 3 x 10^7 10^7 5 x 10^6 4.2 X 10^9 9.0 x 10^12
Electrical Strength 31.2 (780) 30.2 (755) 0.96 (0.23) 31.2 (780) 784
Tensile Modulus 16,767 (2,432) 14,153, (2,053) 930 823 1498 1293 1902 1934 7780 (1128) 1070 (156) 450 (65), 860 (125) 380 (55) 828 (120) 931 (135) 19,650 (2,850) 19,450 (2,821)

Table 2 (Continuation)

Property RO4350B RO3003 RO3006 RO3010 RO4835 RO5880 RO6002 RO6010 RO4003 RO 4360G2
Tensile Strength 203 (29.5)
130 (18.9)
136 (19.7) 17 (2.4) 139 (20.2)
100 (14.5)
131 (19)
97 (14)
Flexural Strength 255 (37) 186 (27) 4364 (633) 276 (40) 213 (31)
145 (21)
Dimensional Stability <0.5 <0.5 <0.3
Coefficient of Thermal Expansion 10
12
32
17
16
25
17
17
24
13
11
16
10
12
32
31
48
237
16
16
24
24
24
24
11
14
46
13
14
28
Tg >280 >280 >280 >280
Td 390 500 500 500 390 500 500 500 425 407
Specific Heat 0.9 0.86 0.8 0.93 (0.22) 1.00 (0.239)
Thermal Conductivity 0.69 0.50 0.79 0.95 0.66 0.22 0.60 0.78 0.71 0.75
Moisture Absorption 0.06 0.04 0.02 0.05 0.05 0.02 0.02 0.05 0.06 0.08
Density 1.86 2.1 2.6 2.8 1.92 2.2 2.1 3.1 1.79 2.16
Copper Peel Strength 0.88 (5.0) 12.7 7.1 9.4 0.88 (5.0) 31.2 (5.5) 8.9 (1.6) 12.3 (2.1) 1.05 (6.0) 5.2 (0.91)
Flammability (3)V-0 V-0 V-0 V-0 V-0 V-0 V-0 94V-0 N/A V-0
Lead-Free Process Compatible Yes Yes Yes Yes Yes Yes Yes Yes Yes

TYPES OF ROGERS PCB MATERIALS

Metal Claddings

  • Rolled
  • Electrodeposited
  • Electrodeposited Reverse Treated
  • Resistive Foil

Bonding Materials

  • Ceramic PTFE Bondply
  • Woven Glass
  • Prepreg
  • Hydrocarbon
  • Thermoset Thermal and Electrically Conductive Adhesive (TECA) Film

Laminates

  • Woven Glass Reinforced Modified Epoxy Laminates
  • PTFE Random Glass Fiber
  • Woven Glass UL 94 V-0 laminates
  • Hydrocarbon
  • PTFE Ceramic
  • Cross-Plied Woven Glass-Reinforced PTFE
  • Woven Glass Reinforced PTFE Antenna Grade Laminates
  • Filled PTFE Composite
  • Woven Glass Reinforced Modified Epoxy IMS

FR-4 MATERIAL VS. ROGERS MATERIAL

Factors FR-4 Material Rogers Material
Dissipation factor (DF) 0.020 0.004
Price Affordable Expensive
Thermal Management This grade material doesn’t handle high temperature well. The Rogers material manages high temperatures perfectly.
Performance Decent Remarkable
Dielectric Constant (DK) 4.5 6.15 to 11
Impedance Stability Lower polarity and it doesn’t stabilize charges well. Higher polarity and stabilizes charges effectively.
Applications The FR-4 isn’t so ideal for space applications because it isn’t outgassing tolerant. Rogers is a better option for space applications because it reduces outgassing effectively.
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OUR COMPANY

In 2005, we founded OurPCB. And ever since, we have grown to be reckoned with in the PCB Assembly Industry. Also, we have top and experienced PCB engineers in our PCB Manufacturing and assembling firm based in China.

THE APPLICATIONS OF THE ROGERS PCB

1. Telecommunication:

Cellular Base Station Antennas, Communication systems, Direct Broadcast Satellite, Microwave Equipment, Carrier-Grade Wi-Fi/ Licensed Assisted Access, 5G Station, etc.


2. Automotive:

Automated Test Equipment (ATE), Automotive Sensors and Radar, etc.


3. RF Engineering:

Power Amplifiers, RF Identification tags, IP Infrastructure, etc.


4. Aeronautic Engineering:

Aircraft Collision Avoidance System, Microstrip Antenna, Backhaul Radios, etc.


5. Computer:

DAS, Advanced Driver Assistance Systems (ADAS), etc.


6. Military:

Jamming Systems, Radio Communication Systems, etc.

THE ADVANTAGES OF THE ROGERS PCB

1. Rogers PCB has a low moisture absorption feature, low thermal expansion, and solid dimensional stability for different conditions.

2. The material of the RogersPCB is compatible and it’s easy to fabricate because the PCB is as thin as 0.1mm.
3. Rogers PCB has an excellent thermal management and it’s ideal for electronic devices and circuits that produce excess heat.
4. With Rogers PCB, there’s the reduction of outgassing in space applications.
5. The Rogers PCB matches trace locations and dimensions, leading it to enhance impedance control.
6. Rogers PCB provides steady high-frequency performance.

ROGERS PCB CASE STUDY

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