PCB Assembly Capabilities

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PCB assembly

Specification PCBA Capability
Placer speed 600,000 chips/hour
Lead Time 25+ Days (To Be confirmed)
SMT SMT, Through Hole Assembly
Single/Double-Side SMT, Single/Double-Sides Mixture Assembly
PCB Size 50mm×50mm ~610mm×508mm
PCB Thickness 0.5mm~4.5mm
Min. diameter /space of BGA 0.2mm/0.35mm
Qualifications ISO 9001:2008
Accuracy <±30µm, under the condition of 3σ,CPK≥1
Minimum width/space of QFP 0.15mm/0.25mm
Minimum Diameter /Space of BGA 0.2mm/0.35mm
Reliability Test Flying Probe Test/Fixture test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, and Micor Metallographic Section Analysis, etc.

OurPCB is focusing on online prototype orders, to meet the requirements for High Quality, Low Cost, Fast Delivery, Easy Ordering from customers around the world.

We can accept 4 kinds of files format (gerber, .pcb, .pcbdoc or .cam file format) for PCB Prototype Manufacturing. We do perform full DRC checks of all Client files and will inform you immediately if we find any problem. We then will work with you to correct the files so they are suitable for manufacturing. Please check our capability overview below for reference. Please contact us if you have a special requirement not listed in the following table.

Specification PCB Capability
Layer Counts 1-50 layers
Lead Time Normal: 5-6 Days
Expedited: 24-48Hours
Materials FR4, Metal Core, Arlon, Taconic, Nelco, Isola, Halogen Free, Rogers, PTFE, PI,etc.
Max. Copper 12 OZ
Finished Board Thickness 0.1 - 10 mm
Min. Line/Track Width&Space 2.5 mil
Qualifications ISO14001:2015, ISO9001:2015, Certified
IATF16949: 2016,Certified
Buried / Blind Via (Non-cross) 0.1 mil
Aspect ratio 20 : 1
Min. Drilling Size(Mechanical) 0.15 mm
Surface Treatment HASL, Lead free HASL,ENIG(+ G/F). Immersion silver/Tin OSP. ENEPIG. bare copper.
Wrap and Twist ≤0.7%
Tolerance PTH/ Pressing fit hole /NPTH ‡/-0.0762 mm /+/-0.05mm /+/-0.05mm
Drill tolerance +/-2mil
BGA pitch 8mil
Laver to layer registration +/-3mil

We strive to make the whole assembly process as easy as possible:

Flex PCB

  • Manufacturing Capability:Conventional Capability;
  • Ultimate Capability:Unconventional ability;
  • Submit to review beyond these Capabilities.
Project Item Normal Capability
FPC Base Material (Adhesive) ShengyiSF302:PI=0.5 mil,1 mil,2 mil;Cu=0.5 oz,1 oz
ShengyiSF305:PI=0.5 mil,1 mil,2 mil;Cu=0.33 oz,0.5 oz,1 oz
FPC Base Material (Adhesiveless) SongxiaRF-775/777:PI=1 mil,2 mil,3 mil;Cu=0.5 oz, 1 oz
(Ultimate:PI=1 mil,2 mil,3 mil;Cu=2 oz)
Xinyang:PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
Taihong PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
Dubang AP:PI=1 mil, 2 mil, 3 mil, 4 mil;Cu=0.5 oz, 1 oz
(Ultimate:PI=1 mil,2 mil,3 mil,4 mil;Cu=2 oz)
Layer 1-4 Layers (Ultimate:5-8 Layers)
Thickness of Finished Product (Flex part,no stiffener) 0.05-0.5 mm (Ultimate:0.5-0.8 mm)
Size of Finished Products(Min) 5 mm*10 mm (Bridgeless);10 mm*10 mm (Bridge)
Ultimate:4 mm*8 mm (Bridgeless);8 mm*8 mm (Bridge)
Size of Finished Products (Max) 9 inch*14 inch
Ultimate:9 inch*23 inch (PI≥1 mil)
Impedance Tolerance Single-Ended:±5Ω(≤50Ω),±10%(>50Ω)
Impedance Tolerance Differencial:±5Ω(≤50Ω),±10%(>50Ω)
Tolerance of Finger Width ±0.1 mm (Ultimate:±0.05 mm)
Min Distance to the Edge of Finger 8 mil (Ultimate:6 mil)
Min Distance between Pads 4 mil (Ultimate:3 mil)
Minimum Laser Hole 0.1mm
Minimum PTH 0.3mm
Min NPTH Tolerance ±2 mil (Ultimate +0,-2 mil or +2 mil,-0)
Solder Bridge Min Width(bottom copper<2OZ) 4 mil(Green),8 mil
Solder Bridge Min Width(bottom copper 2-4OZ) 6 mil,8 mil
Overlay Colour White、Yellow (printed character:White)
Type of Surface Treatment OSP HASL, Lead free HASL, Immersion gold, Hard gold, Immersion silver, OSP
Selective Surface Treatment ENIG+OSP,ENIG+G/F