PCB assembly

PCBA Capability
Placer speed
600,000 chips/hour
Lead Time
25+ Days (To Be confirmed)
SMT, Through Hole Assembly
Single/Double-Side SMT, Single/Double-Sides Mixture Assembly
PCB Size
50mm×50mm ~610mm×508mm
PCB Thickness
Min. diameter /space of BGA
ISO 9001:2008
<±30µm, under the condition of 3σ,CPK≥1
Minimum width/space of QFP
Minimum Diameter /Space of BGA
Reliability Test
Flying Probe Test/Fixture test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, and Micor Metallographic Section Analysis, etc.


OurPCB is focusing on online prototype orders, to meet the requirements for High Quality, Low Cost, Fast Delivery, Easy Ordering from customers around the world.

We can accept 4 kinds of files format (gerber, .pcb, .pcbdoc or .cam file format) for PCB Prototype Manufacturing. We do perform full DRC checks of all Client files and will inform you immediately if we find any problem. We then will work with you to correct the files so they are suitable for manufacturing. Please check our capability overview below for reference. Please contact us if you have a special requirement not listed in the following table.

PCB Capability
Layer Counts
1-50 layers
Lead Time
Normal: 5-6 Days
Expedited: 24-48Hours
FR4, Metal Core, Arlon, Taconic, Nelco, Isola, Halogen Free, Rogers, PTFE, PI,etc.
Max. Copper
12 OZ
Finished Board Thickness
0.1 - 10 mm
Min. Line/Track Width&Space
2.5 mil
ISO14001:2015, ISO9001:2015, Certified
IATF16949: 2016,Certified
Buried / Blind Via (Non-cross)
0.1 mil
Aspect ratio
20 : 1
Min. Drilling Size(Mechanical)
0.15 mm
Surface Treatment
HASL, Lead free HASL,ENIG(+ G/F). Immersion silver/Tin OSP. ENEPIG. bare copper.
Wrap and Twist
Tolerance PTH/ Pressing fit hole /NPTH
‡/-0.0762 mm /+/-0.05mm /+/-0.05mm
Drill tolerance
BGA pitch
Laver to layer registration

We strive to make the whole assembly process as easy as possible:

Flex PCB

  • Manufacturing Capability:Conventional Capability;
  • Ultimate Capability:Unconventional ability;
  • Submit to review beyond these Capabilities.
Project Item
Normal Capability
FPC Base Material (Adhesive)
ShengyiSF302:PI=0.5 mil,1 mil,2 mil;Cu=0.5 oz,1 oz
ShengyiSF305:PI=0.5 mil,1 mil,2 mil;Cu=0.33 oz,0.5 oz,1 oz
FPC Base Material (Adhesiveless)
SongxiaRF-775/777:PI=1 mil,2 mil,3 mil;Cu=0.5 oz, 1 oz
(Ultimate:PI=1 mil,2 mil,3 mil;Cu=2 oz)
Xinyang:PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
Taihong PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
Dubang AP:PI=1 mil, 2 mil, 3 mil, 4 mil;Cu=0.5 oz, 1 oz
(Ultimate:PI=1 mil,2 mil,3 mil,4 mil;Cu=2 oz)
1-4 Layers (Ultimate:5-8 Layers)
Thickness of Finished Product (Flex part,no stiffener)
0.05-0.5 mm (Ultimate:0.5-0.8 mm)
Size of Finished Products(Min)
5 mm*10 mm (Bridgeless);10 mm*10 mm (Bridge)
Ultimate:4 mm*8 mm (Bridgeless);8 mm*8 mm (Bridge)
Size of Finished Products (Max)
9 inch*14 inch
Ultimate:9 inch*23 inch (PI≥1 mil)
Impedance Tolerance
Impedance Tolerance
Tolerance of Finger Width
±0.1 mm (Ultimate:±0.05 mm)
Min Distance to the Edge of Finger
8 mil (Ultimate:6 mil)
Min Distance between Pads
4 mil (Ultimate:3 mil)
Minimum Laser Hole
Minimum PTH
Min NPTH Tolerance
±2 mil (Ultimate +0,-2 mil or +2 mil,-0)
Solder Bridge Min Width(bottom copper<2OZ)
4 mil(Green),8 mil
Solder Bridge Min Width(bottom copper 2-4OZ)
6 mil,8 mil
Overlay Colour
White、Yellow (printed character:White)
Type of Surface Treatment
OSP HASL, Lead free HASL, Immersion gold, Hard gold, Immersion silver, OSP
Selective Surface Treatment