PCB Assembly Capabilities

  • Placer speed of 60,000 chips/hour and a lead time of 25+ days.
  • We support various PCB specifications, including 1-64 layers, with a minimum track width of 1.8 mil and maximum copper thickness of 1000um.
  • prototype promotions, mass production, rapid turnaround, and turnkey solutions, ensuring a streamlined assembly process.
Special Offer Get $100off your order!
Offer valid for new customers only. No MOQ required.
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PCB assembly

Specification PCBA Capability
Placer speed 600,000 chips/hour
Lead Time 25+ Days (To Be confirmed)
SMT SMT, Through Hole Assembly
Single/Double-Side SMT, Single/Double-Sides Mixture Assembly
PCB Size 50mm×50mm ~610mm×508mm
PCB Thickness 0.5mm~4.5mm
Min. diameter /space of BGA 0.2mm/0.35mm
Qualifications ISO 9001:2015
Accuracy <±30µm, under the condition of 3σ,CPK≥1
Minimum width/space of QFP 0.15mm/0.25mm
Minimum Diameter /Space of BGA 0.2mm/0.35mm
Reliability Test Flying Probe Test/Fixture test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, and Micor Metallographic Section Analysis, etc.

OurPCB is focusing on online prototype orders, to meet the requirements for High Quality, Low Cost, Fast Delivery, Easy Ordering from customers around the world.

We can accept 4 kinds of files format (gerber, .pcb, .pcbdoc or .cam file format) for PCB Prototype Manufacturing. We do perform full DRC checks of all Client files and will inform you immediately if we find any problem. We then will work with you to correct the files so they are suitable for manufacturing. Please check our capability overview below for reference. Please contact us if you have a special requirement not listed in the following table. You can also get an online pcb quote by reaching out to our team today!

Specification PCB Capability
Layer Counts 1-64 layers
Lead Time Normal: 5-6 Days
Expedited: 24-48Hours
Materials FR4, Metal Core, Arlon, Taconic, Nelco, Isola, Halogen Free, Rogers, PTFE, PI,etc.
Max. Copper 1000um
Finished Board Thickness 0.1 - 12 mm
Size of Finished Products(Max) 22.5 * 47.2 inch
Size of Finished Products(Min) 2 * 5mm
Min. Line/Track Width&Space of Inner Layer 1.8/1.8 mil
Min. Line/Track Width&Space of Outer Layer 2/2 mil
Buried / Blind Via (Non-cross) 0.1 mil
Aspect ratio 40 : 1
Min. Drilling Size(Mechanical) 0.1 mm
Surface Treatment HASL, Lead free HASL, ENIG(+ G/F), Immersion silver/Tin, OSP, ENEPIG, bare copper.
Wrap and Twist ≤0.5%
Tolerance PTH/ Pressing fit hole /NPTH ±0.0762 mm /±0.05mm /±0.05mm
Drill tolerance ±2mil
BGA pitch 8mil
Layer to layer registration ±3mil
Advanced Via & Hole Structures Blind/Buried Vias, Via-in-Via, Mechanically Crossed Blind Vias, Stacked Vias, Via-in-Pad
Impedance Control ±5Ω (<50Ω), ±10% (≥50Ω)
HDI 18L any layer HDI (8+N+8 structure)
Qualifications ISO14001:2015, ISO9001:2015, ISO 13485:2016, IATF16949: 2016, Certified

We strive to make the whole assembly process as easy as possible:

Flex PCB

  • Manufacturing Capability:Conventional Capability;
  • Ultimate Capability:Unconventional ability;
  • Submit to review beyond these Capabilities.
Project Item Normal Capability
FPC Base Material (Adhesive) ShengyiSF302:PI=0.5 mil,1 mil,2 mil;Cu=0.5 oz,1 oz
ShengyiSF305:PI=0.5 mil,1 mil,2 mil;Cu=0.33 oz,0.5 oz,1 oz
FPC Base Material (Adhesiveless) SongxiaRF-775/777:PI=1 mil,2 mil,3 mil;Cu=0.5 oz, 1 oz
(Ultimate:PI=1 mil,2 mil,3 mil;Cu=2 oz)
Xinyang:PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
Taihong PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz
Dubang AP:PI=1 mil, 2 mil, 3 mil, 4 mil;Cu=0.5 oz, 1 oz
(Ultimate:PI=1 mil,2 mil,3 mil,4 mil;Cu=2 oz)
Layer 1-6 Layers (Ultimate:7-10 Layers)
Thickness of Finished Product (Flex part,no stiffener) 0.05-0.5 mm (Ultimate:0.5-0.8 mm)
Size of Finished Products(Min) 5 mm*10 mm (Bridgeless);10 mm*10 mm (Bridge)
Ultimate:4 mm*8 mm (Bridgeless);8 mm*8 mm (Bridge)
Size of Finished Products (Max) 9 inch*14 inch
Ultimate:9 inch*23 inch (PI≥1 mil)
Impedance Tolerance Single-Ended:±5Ω(≤50Ω),±10%(>50Ω)
Ultimate:Single-Ended:±3Ω(≤50Ω),±8%(>50Ω)
Impedance Tolerance Differencial:±5Ω(≤50Ω),±10%(>50Ω)
Ultimate:Differencial:±4Ω(≤50Ω),±8%(>50Ω)
Tolerance of Finger Width ±0.1 mm (Ultimate:±0.05 mm)
Min Distance to the Edge of Finger 8 mil (Ultimate:6 mil)
Min Distance between Pads 4 mil (Ultimate:3 mil)
Minimum Laser Hole 0.1mm
Minimum PTH 0.3mm
Min NPTH Tolerance ±2 mil (Ultimate +0,-2 mil or +2 mil,-0)
Solder Bridge Min Width(bottom copper<2OZ) 4 mil(Green),8 mil
Solder Bridge Min Width(bottom copper 2-4OZ) 6 mil,8 mil
Overlay Colour White、Yellow (printed character:White)
Type of Surface Treatment OSP HASL, Lead free HASL, Immersion gold, Hard gold, Immersion silver, OSP
Selective Surface Treatment ENIG+OSP,ENIG+G/F
Customer rating
★★★★⯨ 4.6 (183)
Price range
$3 – $250 / board
Lead time
6–14 days
Factory Capacity
Available● In stock
ISO 9001ISO 13485IATF 16949UL RecognizedIPC Class 2/3

Order options

Prototype
1–10 boards
⏱ 24–96 h build

Quick-turn PCB prototypes with full CAM review and DFM feedback before fabrication.

Low-Volume
10–1,000 boards
⏱ 6–10 days

Bridge production with flexible quantities, multiple surface finishes, and IPC Class 2/3.

Mass Production
1,000+ boards
⏱ 2–3 weeks

Cost-optimised high-volume PCB manufacturing with automated inspection and testing.

★ What customers say

4.6
★★★★⯨
Based on 183 verified customer reviews
S
Sophie Lambert★★★★★
Founder, Brightloop · FR · 2025-03-09

Clear, fast updates the whole way through the PCB boards order.

E
Emma Lindqvist★★★★★
Design Engineer, Frostbyte AB · SE · 2025-04-23

Fast lead time on the PCB boards run without cutting any corners.

J
James Whitfield★★★★☆
CTO, Pebble Instruments · GB · 2025-07-11

Impeccable PCB boards — no defects across the whole batch.

C
Clara Fischer★★★★☆
EE, Rheinwerk · DE · 2024-08-25

Pricing on the PCB boards run was noticeably better than our previous supplier.

P
Paul Dupont★★★★★
CTO, Voltaire Systems · FR · 2025-10-02

Careful packaging on the PCB boards and complete documentation.

O
Omar Farouk★★★★☆
Procurement, Nile Power · EG · 2024-04-15

Got genuinely useful DFM feedback on the PCB boards; clearly people who know fabrication.