5 Star Rating on 
✅ 1 to 64-layer rigid PCBs
✅ Fast turnaround times
✅ Intellectual property protection
Our engineers can design your rigid PCBs and perform comprehensive design and manufacturability reviews.
Rapid prototyping for testing and validation of your rigid PCB designs before full-scale production.
End-to-end services, including high-precision fabrication and professional assembly.
Complete box build solutions, integrating your PCBs into fully functional electronic devices.
Fast turnaround times to meet tight deadlines without compromising on quality.
Flexibility for both small-scale prototypes and large-scale production runs.
| Specification | PCB Capability |
|---|---|
| Layer Counts | 1-64 layers |
| Lead Time | Normal: 5-6 Days Expedited: 24-48Hours |
| Materials | FR4, Metal Core, Arlon, Taconic, Nelco, Isola, Halogen Free, Rogers, PTFE, PI,etc. |
| Max. Copper | 1000um |
| Finished Board Thickness | 0.1 – 12 mm |
| Size of Finished Products(Max) | 22.5 * 47.2 inch |
| Size of Finished Products(Min) | 2 * 5mm |
| Min. Line/Track Width&Space of Inner Layer | 1.8/1.8 mil |
| Min. Line/Track Width&Space of Outer Layer | 2/2 mil |
| Buried / Blind Via (Non-cross) | 0.1 mil |
| Aspect ratio | 40 : 1 |
| Min. Drilling Size(Mechanical) | 0.1 mm |
| Surface Treatment | HASL, Lead free HASL, ENIG(+ G/F), Immersion silver/Tin, OSP, ENEPIG, bare copper. |
| Wrap and Twist | ≤0.5% |
| Tolerance PTH/ Pressing fit hole /NPTH | ±0.0762 mm /±0.05mm /±0.05mm |
| Drill tolerance | ±2mil |
| BGA pitch | 8mil |
| Layer to layer registration | ±3mil |
| Advanced Via & Hole Structures | Blind/Buried Vias, Via-in-Via, Mechanically Crossed Blind Vias, Stacked Vias, Via-in-Pad |
| Impedance Control | ±5Ω (<50Ω), ±10% (≥50Ω) |
| HDI | 18L any layer HDI (8+N+8 structure) |
| Qualifications | ISO14001:2015, ISO9001:2015, ISO 13485:2016, IATF16949: 2016, Certified |
Mon-Fri: 24 hours,
Sat: 9am-6pm, GMT+8
Reach us at
sales@ourpcb.net
24 hours online
+86-199-30589219
Mon-Fri: 24 hours,
Sat: 9am-6pm, GMT+8
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Fast-turn rigid PCB prototypes with full DFM and AOI inspection.
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High-volume rigid PCB assembly with comprehensive test protocols.
Careful packaging on the rigid PCB assemblies and complete documentation.
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