High Frequency PCB Manufacturer

OurPCB, a high frequency PCB manufacturer, delivers advanced circuit boards designed for signal transmission above 500 MHz. We offer custom RF and microwave PCBs using materials such as Rogers, PTFE, and ceramic-filled laminates. Our production ensures tight impedance control, low signal loss, and consistent performance for 5G, radar, and aerospace applications.

What is a High Frequency PCB Communication Circuits?

High-frequency printed circuit boards (PCB) are specifically designed to operate at high frequencies. A high-frequency PCB design makes it easy to achieve fast data transmission and improved signal integrity. There is a much higher demand these days for high-speed communication and wireless technologies, so it’s important to understand the ins and outs of high-frequency PCBs.

PCB Manufacturing Process

What Materials are Used for Fabricating High-Frequency PCBs?

The PCB materials used in a high-frequency printed circuit board must have very specific electrical and mechanical properties. This is to make sure that the high-frequency board performs well at higher frequencies. Here are some of the most common materials used.

FR-4

Even though standard FR-4 is not ideal for high frequencies, specialized high-frequency versions with lower Dk and Df can definitely work.

Rogers Materials

Rogers Corporation makes a range of high-performance laminates like RO4350B and RT/duroid, which can provide powerful electrical properties for high-frequency PCB applications.

Taconic Materials

Taconic has materials like RF-35, TLY, and TLX, which are designed for high-frequency and microwave applications.

PTFE (Teflon) Based Materials

These materials can give you very low Dk and Df, making them great for extremely high-frequency applications.

Ceramic-Filled PTFE Composites

These materials bring together the strong electrical properties of PTFE with a higher dimensional stability. An advanced ceramic substrate is usually used for applications that need powerful thermal stability and low signal loss.

Liquid Crystal Polymer (LCP)

LCP has fantastic electrical properties and can be used for both rigid and flexible high-frequency PCBs.

Polyimide

This material is popular because it has a high temperature resistance. Polyimide is used in high-frequency applications that need thermal stability.

Low-Loss Prepregs

Specialized prepreg materials can be used to bond layers in multilayer high-frequency PCBs while ensuring low signal loss.

What are High-Frequency PCB Properties?

High-frequency PCBs are incredibly unique in comparison to standard PCBs. Here are a few important properties that make them different:

Low Dielectric Constant (Dk): A high-frequency PCB material has a low Dk. This reduces signal propagation delay and minimizes signal loss.
Low Dissipation Factor (Df): A low Df makes sure that there is minimal energy loss as signals travel through the board. This maintains signal integrity.
Controlled Impedance: High-frequency PCBs keep consistent impedance throughout the board to prevent signal reflections and make sure there is efficient transmission.
Low Coefficient of Thermal Expansion (CTE): High-frequency material with low CTE is used to prevent board warping. This also maintains the dimensional stability at high frequencies.
Smooth Copper Foil: Ultra-smooth copper foil is used to lower skin effect losses at high frequencies.
Tight Manufacturing Tolerances: High-frequency PCBs need incredibly accurate manufacturing to keep consistent electrical properties.
Improved Signal Integrity: These boards are engineered to minimize crosstalk, EMI, and signal distortion.
Advanced Power Handling: High-frequency PCBs usually have better thermal management to handle the increased power densities that come with high-frequency operation.
Specialized Transmission Line Structures: Microstrip and stripline configurations are typically used to control impedance and reduce radiation from frequency signals.
Advanced Shielding Techniques: High-frequency PCBs often have extra shielding layers or structures to cut down on EMI.

These special properties allow radar PCBs to easily manage challenges with high-frequency and high-speed signals. They make sure that there is high reliability and powerful performance in the most demanding applications!

High-frequency PCBs are incredibly unique in comparison to standard PCBs. Here are a few important properties that make them different:

Low Dielectric Constant (Dk): A high-frequency PCB material has a low Dk. This reduces signal propagation delay and minimizes signal loss.
Low Dissipation Factor (Df): A low Df makes sure that there is minimal energy loss as signals travel through the board. This maintains signal integrity.
Controlled Impedance: High-frequency PCBs keep consistent impedance throughout the board to prevent signal reflections and make sure there is efficient transmission.
Low Coefficient of Thermal Expansion (CTE): High-frequency material with low CTE is used to prevent board warping. This also maintains the dimensional stability at high frequencies.
Smooth Copper Foil: Ultra-smooth copper foil is used to lower skin effect losses at high frequencies.
Tight Manufacturing Tolerances: High-frequency PCBs need incredibly accurate manufacturing to keep consistent electrical properties.
Improved Signal Integrity: These boards are engineered to minimize crosstalk, EMI, and signal distortion.
Advanced Power Handling: High-frequency PCBs usually have better thermal management to handle the increased power densities that come with high-frequency operation.
Specialized Transmission Line Structures: Microstrip and stripline configurations are typically used to control impedance and reduce radiation from frequency signals.
Advanced Shielding Techniques: High-frequency PCBs often have extra shielding layers or structures to cut down on EMI.

Benefits of High-Frequency PCBs

High-frequency PCBs come with tons of benefits that make them essential when it comes to modern electronics:

Improved Signal Integrity

High-frequency PCBs maintain signal quality at high speeds. This reduces distortion and loss.

Faster Data Transmission

These PCBs allow for fast data transfer, which is essential for high-speed digital and wireless applications.

Reduced EMI

Proper design and materials help reduce EMI, which improves the overall system performance.

Higher Bandwidth

High-frequency PCBs can support wider frequency ranges, which means an increased data capacity.

Miniaturization

Advanced designs allow smaller form factors without affecting performance.

Improved Reliability

Specialized materials and design techniques improve long-term reliability in high-pressure environments.

Higher Power Efficiency

High-frequency PCBs can handle higher power densities with better thermal management.

Versatility

These PCBs support tons of different applications, from consumer electronics to aerospace systems.

Cost-Effective

Even though these PCBs can be initially more expensive, they can lower the total system costs by improving performance and reliability.

PCB Assembly Services

Millions of business and innovators use OurPCB

PCB Board Process

Order Received

Component Procurement
Preparation
PCB Manufacture
Make Process Flow

Soldering

Solder Printing/Wave Soldering
SMT/Plugging
Inspection (repair if necessary)
AOI (repair if necessary)
Transfer

Parts Assembly

Manual Assembly
Cleaning
Wire Screw
Inspection
Repair If Necessary

Finalization

Final Confirmation
Packing
Shiping

Technical Capabilities

Capabilities & Services

One-stop PCBA Services (PCB Manufacturing + Components Sourcing + Assembly)
SMT Assembly + THT Assembly, Single/double-sided Assembly Mixed PCB Assembly
BGA Rework
60,000 Chips/Hour
Down to 01005/0210 Size
Accuracy<±40μm
Min. QFN Pin Width/Space: 0.15mm/0.25mm
Min. BGA Diameter/Space: 0.2mm/0.35mm

Rigid, Flex, HDI, & High-speed Power Boards
Up to 64 Layers
60GHz High Frequencies
Min. Trace Width/Spacing: 1.8mil/1.8mil
AOI, X-ray, ICT & FCT Testing
Controlled Impedance
ISO 9001, ISO 13485, ISO 14001, IATF 16949, IPC-A-610, UL Certified
Automotive, Medical, & Military-grade PCBA Manufacturing

PCB Factory Gallery

FAQs on What is a High-Frequency PCB Communication Circuit?

What is the maximum frequency of a PCB?

The maximum high-frequency signals of a PCB can reach up to several hundred GHz in specialized applications; however, the majority of commercial high-frequency PCB applications typically operate in the range of a few GHz to tens of GHz. The maximum signal will also depend on the kind of materials and the design you use.

What is the difference between high-speed and high-frequency PCBs?

High-speed PCBs focus on fast digital signal transitions, whereas high-frequency circuits are designed for efficient analog or RF signal transmission at high frequencies.

What are the common applications of high-frequency PCBs?

High-frequency printed circuit boards (PCBs) are essential in any system that must reliably operate at radio-frequency (RF) and microwave frequencies. Typical applications include:

Wireless communication: 5G base stations, Wi-Fi routers, Bluetooth devices
Satellite communication: Transponder modules, ground-station equipment
Aerospace and defense: Radar systems, avionics, missile guidance
Medical equipment: MRI machines, ultrasound scanners, RF ablation devices
Automotive: Vehicle radar (adaptive cruise control), V2X communication
Broadcasting: TV/radio transmitters and receivers
Industrial automation: High-speed data links, automated inspection systems
Research and development: Test fixtures, prototype RF frontend modules
RF/microwave devices: Amplifiers, filters, oscillators, antenna arrays

What are the key guidelines for designing high-frequency PCBs?

Designing high-frequency PCBs requires careful attention to materials, layout, and signal integrity. Follow these steps:

Understand Your Needs – Define the operating frequency range, power levels, and environmental conditions.
Choose Your Materials – Select laminates with appropriate dielectric constant (Dk), loss tangent (Df), and coefficient of thermal expansion (CTE).
Plan the PCB Stack-up – Arrange signal and plane layers to minimize crosstalk and maintain controlled impedance; include solid ground planes for shielding.
Establish Controlled Impedance – Calculate trace widths and spacings to achieve your target impedance (commonly 50 Ω or 75 Ω) and ensure consistency across the board.
Optimize Trace Routing – Keep traces as short and direct as possible. Use 45° or curved bends instead of right angles to reduce reflections.
Manage Signal Integrity – Separate high-speed from low-speed nets. Route critical signals as differential pairs to reject common-mode noise.
Use Ground Planes – Provide continuous, solid ground planes to offer low-impedance return paths and suppress EMI.
Design Proper Vias – Employ small, closely spaced vias for grounding. Use buried or blind vias where necessary to preserve high-frequency performance.
Follow Proper Termination – Apply series, parallel, or Thevenin terminations to damp reflections at the ends of high-speed lines.
Consider EMI/EMC – Incorporate shielding, stitching vias, and grounding strategies to meet radiated and conducted emissions requirements.
Plan Thermal Management – Design for adequate heat dissipation—use thermal vias, copper pours, and heat sinks for high-power RF sections.
Simulate and Analyze – Validate your design with electromagnetic and signal-integrity simulation tools before fabrication.
Design for Manufacturability – Ensure your stack-up, via sizes, trace geometries, and material choices align with your PCB fabricator’s capabilities and tolerances.