Specialized In Multilayer And Rigid-Flex Technology.

Flexible Circuit Manufacturing & Assembly as well as multilayer flex and rigid-flex circuits and also provide SMT component assembly on these products.

For industries such as Aerospace, Consumer Electronics, Opto Electronics, Medical, Industrial controls, Semiconductor, Test & Measurements, Wireless Networks, Wearable Electronics, and Military sectors.

Specification
Flexible PCB Capability
Layer Counts
1-4 Layers (Ultimate: 5-8 Layers)
Tolerance of Finger Width
±0.1 mm (Ultimate: ±0.05 mm)
Min Distance between Pads
4 mils (Ultimate:3 mil)
The thickness of Finished Product(Flex part,no stiffener)
0.05-0.5 mm (Ultimate:0.5-0.8 mm)
Type of Surface Treatment
OSP HASL, Lead-free HASL, Immersion gold, Hard gold, Immersion silver, OSP
Impedance Tolerance: Single-Ended
±5Ω(≤50Ω),±10%(>50Ω)
Ultimate: Single-Ended
±3Ω(≤50Ω),±8%(>50Ω)

Flexible PCB Manufacturing Process

Double-Sided Flex PCB

Cutting → Drill Hole → PTH → Electroplate → Pre-Processing → Dry Film → Check Position → Exposure → Development → Graphic Electroplating → Etching → Decorating → Surface Processing → Cover the film → Press → Solidification → Immersion Nickel → Printing character → Shear → Electrical Measurement → Punching → Final inspection → Packing → Shipment

Single Panel

Cutting  →  Drill Hole  →  Dry Film  →  Check Position  →  Exposure  →  Development  →  Etching  →  Decorating  →  Surface Processing  →  Cover the film  →  Press  →  Solidification  →  Immersion Nickel  →  Printing character  →  Shear  →  Electrical Measurement  →  Punching  →  Final inspection  →  Packing  →  Shipment

flexible pcb board CASE STUDY

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