BT Resin for High-Temperature
Multilayer PCB
Manufacturing

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ISO 9001/UL Certified
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PCB Assembly Specialists
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97% of PCB Shipped on Time
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98% of PCB Delivered to Spec
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Delivery Guarantee

PCB Manufacturing Process

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Online Quote
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Upload PCB File
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Order Review
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Payment
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Order Updates
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Delivery
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Confirm Received

Why Choose Our BT PCB Manufacturer Services?

Why does PCB Testing Matter in Assembly?

Factory-Ready for Ultra-Fine Assembly

Our dual 10,000 m² PCB assembly houses in Shenzhen and Shijiazhuang are equipped with high-speed SMT assembly lines capable of placing fine-pitch parts with ±25 µm tolerance.

Each line includes temperature- and humidity-controlled environments, active anti-static systems, and vacuum transport for handling thin or flex printed circuits.

Certified for High-Reliability Fine-Pitch Workflows

We are fully certified to ISO 9001, IATF 16949, and IPC-A-610 Class 2 & 3, supporting applications where fine-pitch PCB assembly must meet elevated acceptance criteria for solder joint geometry, lead coplanarity, and component body clearance.

Our QA workflows are built to handle fine-pitch PCBs requiring zero solder bridging and uniform joint fillets across dense arrays.

Inspection Systems for High Pin Count Devices

All assemblies involving ball pitch under 0.5 mm, QFN, or PoP packages undergo X-ray inspection, SPI, and AOI with 15 µm resolution optics.

We detect voids, open leads, insufficient solder, lifted terminations, and hidden shorts. This inspection process is a requirement for successful assembly when working with components that provide no visible solder access.

Engineering Review for Pitch-Specific Risks

Every fine-pitch electronic assembly receives a DFM and DFA review focused on stencil coverage, aperture tuning, pcb design limitations, and routing near fine-pitch ICs.

We assist in verifying pad design, thermal pad exposure, and via escape planning, important for high I/O packages like BGA and chip scale layouts where misalignment or solder blockage can compromise yield.

Turnkey Component Sourcing and Lot Control

We offer full assembly component sourcing through partners like Digi-Key, Mouser, and WPG, including traceable lots for hard-to-find or moisture-sensitive electronic components.

Components are stored under MSL-compliant conditions, with drying cabinets and vacuum packaging for all incoming fine-pitch parts.

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Vapor Degreasing (For Fine-Pitch Components)

We use vapor degreasing to clean fine-pitch SMT assemblies where low standoff heights prevent rinsing under components. The process heats a fluorinated cleaning fluid such as HFE-72DA until it vaporizes at 58 °C.

Our sealed-chamber systems recover 90% of solvent through closed-loop distillation and vapor filtration. Because no water is used, this PCBA cleaning method prevents capillary trapping and delivers dry, spot-free boards that are immediately ready for conformal coating or inspection.

Aqueous Cleaning (For High-Volume Batch Cleaning)

For high-throughput cleaning, we operate fully enclosed aqueous cleaning systems that combine high-pressure spray with saponified deionized water at 60 °C. These systems target assemblies with solder paste, rosin, or water-soluble flux, removing active ions and organic residue from both sides of the board.

Our InJet platforms use 2.0 bar rotary spray heads for impingement and cascade rinsing with resistivity sensors that maintain <1.56 µg/cm² NaCl equivalent. Each cleaned board is force-dried at 70 °C for 10 minutes to eliminate moisture and prepare the surface for optical inspection or downstream processing. This is the most efficient method for batch-based PCBA cleaning at scale.

Manual/benchtop cleaning (for rework and selective soldering)

When boards require post-assembly rework or selective soldering, we apply a controlled manual cleaning process to treat localized contamination. Technicians begin by applying Decotron T383 or high-purity IPA to the assembly surface, then scrubbing with anti-static brushes at a 45° angle and 250 g pressure.

Flux is then removed using a directional aerosol rinse, and drying is completed with 30 psi filtered air or lint-free polyester wipes. This method allows us to clean the PCBA without subjecting sensitive components to immersion or thermal stress. We document all manual cleaning steps for traceability on high-reliability builds in automotive, medical, and aerospace programs.

Why Choose Our PCB Testing Services?

why choose our pcb testing services
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Millions of business and innovators use OurPCB

PCB Board Process

Design (1 day)

  • Upload Schematic to Get a Quote
  • PCB Review and Quotation
  • Customer Makes Payment
  • Evaluation & Confirmation of Plan
  • Design Start

Layout (1 day)

  • Layer Stack-up Design
  • Design Rule Setting
  • Component Placement Design
  • Confirmation & Optimization
  • Fanout

Routing (1 day)

  • Fanout Optimization
  • PCB Routing
  • Equal-length Adjustment
  • Routing Optimization
  • DRC Check
  • Routing Confirmation

Optimization (1 day)

  • Silkscreen Adjustment
  • Data Output
  • Customer Final Confirmation
  • Production Debugging
  • Archiving Projects
  • Finish

PCB Board Process

Order Received

  • Component Procurement
  • Preparation
  • PCB Manufacture
  • Make Process Flow

Soldering

  • Solder Printing/Wave Soldering
  • SMT/Plugging
  • Inspection (repair if necessary)
  • AOI (repair if necessary)
  • Transfer

Parts Assembly

  • Manual Assembly
  • PCBCleaning
  • Wire Screw
  • Inspection
  • Repair If Necessary

Finalization

  • Final Confirmation
  • Packing
  • Shipping

Our BT PCB Capabilities

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Trace and Space Imaging for High-Density Layouts

We image BT PCB circuit boards with trace/space down to 0.003 in. / 0.003 in. on 0.5 oz base copper using LDI exposure. Outer-layer image registration is held to ±0.0005 inches, with layer-to-layer alignment verified optically.

Our imaging process supports impedance-controlled structures, matched trace delay, and complex ground/power pair routing. Finished trace geometry is validated with cross-section inspection and etch factor compensation for high-performance RF and memory designs.

Copper Weight and Plating Control

OurPCB plates inner layers up to 2 oz and outer layers up to 3 oz, maintaining ±10 percent plating uniformity across all surfaces and hole walls. We process BT resin PCB material using plating chemistries optimized for surface adhesion and low void rate.

Finished copper thickness is measured on both surface traces and via walls using inline XRF scanners, held to ±10% uniformity per IPC-6012 Class 3 standards, and confirmed post-etch by calibrated micrometer on etched coupons. This ensures thermal performance and current carrying capacity are matched to the BT PCB layout and stackup.

Which Industries Use Our BT PCBs in
High-Performance
Applications?

BT PCB FAQs

What does BT stand for in BT PCB?

BT stands for bismaleimide triazine, a thermoset resin used as the base of the BT resin PCB material stackup. It’s formed by polymerizing bismaleimide and triazine monomers into a cross-linked structure with high thermal and electrical stability.

As a substrate material, it offers a glass transition temperature (Tg) between 180 °C and 250 °C (356 °F to 482 °F) and a dielectric constant (Dk) between 3.2 and 3.5 at 1 GHz, making it suitable for multilayer BT PCBs in high-frequency digital and RF applications.

What is BT resin made of?

BT resin is a thermoset polymer synthesized by reacting bismaleimide (BMI) with cyanate esters, which cure into triazine ring structures during thermal processing. This cross-linked network creates a high-strength molecular backbone that delivers glass transition temperatures (Tg) between 180 °C and 250 °C (356 °F to 482 °F) and Z-axis expansion rates below 60 ppm/°C.

The bismaleimide component enhances mechanical rigidity and thermal resistance, while the triazine groups reduce dielectric loss and moisture absorption. BT resin is often modified with epoxy resin or inorganic fillers to adjust flow behavior, CTE alignment, and prepreg bond uniformity across multilayer stackups. These properties enable bt resin pcb material to maintain structural and electrical performance during multilayer lamination, reflow, and high-frequency signal propagation.

When was BT resin first developed?

BT resin was developed in the 1970s by Mitsubishi Gas Chemical Company (MGC) to meet the aerospace sector’s demand for thermally stable, high-Tg packaging substrates. The material is synthesized from bismaleimide and triazine compounds, forming a thermoset polymer with excellent dielectric strength and thermal endurance.

In 1985, BT resin was adopted by the semiconductor industry as a cost-effective alternative to ceramic substrates for chip packaging. Its ability to maintain structural integrity during wire bonding, reflow, and molding cycles made it ideal for CSPs and memory modules. Today, MGC supplies over 90% of the global BT resin market, positioning BT as the industry standard for high-reliability, high-density interconnect builds.

How does BT resin improve thermal management?

BT resin PCB material enhances thermal management through its high thermal decomposition temperature (Td ≥340 °C), low CTE, and high glass content. The resin-glass interface prevents delamination during thermal shock, while its structure allows consistent via plating and surface planarity under multi-reflow conditions.

BT laminates in power modules and control systems enable heat dissipation across copper planes and minimize thermal gradient deformation. Testing includes T288 delamination cycles, Td via DSC, and interlaminar peel strength.

Is BT substrate moisture-resistant?

Yes, BT substrate material maintains low moisture absorption rates below 0.2% by weight, making it suitable for applications exposed to reflow, cleaning, or high-humidity environments. Its tightly cross-linked polymer network resists hydrolysis and ion migration, preventing dielectric degradation and delamination.

OurPCB verifies moisture sensitivity level (MSL) performance using pre-bake cycles, outgassing analysis, and reflow simulation per J-STD-020 and J-STD-033 standards for BT resin PCB storage and handling.

What are the mechanical properties of BT resin PCBs?

BT PCBs fabricated from bismaleimide triazine exhibit flexural strength above 50,000 psi, high hardness, and excellent dimensional stability. They resist warpage and via fracture under mechanical stress due to their low Z-axis expansion and uniform glass reinforcement.

Drilling quality is enhanced by the material’s hardness and brittleness balance, enabling clean microvia formation. Mechanical strength is validated using IPC-TM-650 test methods for peel strength, flexural modulus, and thermal stress performance.

Ready to Start Your BT PCB Manufacturing Project?

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