Rigid-Flex boards are formed by pressing and combining the flexible and the rigid board according to the relevant process requirements.

Mainly Applications:Military Weaponry, Aerospace Systems, Cell Phones, Digital Cameras.

More Efficient Advanced Technology & Perfect Solution

Specification
PCB Capability
Build Time
3days - 2weeks
Board Size
Min : 6mm x 6mm
Max : 457mm x 610mm
Board Thickness
0.6mm - 5.0mm
Copper Weight (Finished)
0.5oz - 2.0oz
Min Tracing/Spacing
3mil / 3mil
Solder Mask Color & Silkscreen Color
Same as Normal PCBs
Surface Finish
HASL - Hot air solder leveling
Lead - free HASL - RoHS
ENIG - RoHS
Min Drilling Hole Diameter
8mil
Impedance control
±10%
Other Techniques
HDI
Gold fingers
Stiffener (only for PI/FR4 substrate)

Stack-Ups Structures and Design

Non-lamination rigid-flex board
Lamination rigid-flex board
Non-lamination rigid-flex board
Lamination rigid-flex board

CASE STUDY

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