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Rigid-Flex PCB is formed by pressing and combining the flexible and rigid board according to the relevant process requirements.
Mainly Applications: Cell Phones, Digital Cameras.
More Efficient Advanced Technology & Perfect Solution.
Specification
Rigid-Flex boards Capability
Build Time
3days - 2weeks
Board Size
Min : 6mm x 6mm
Max : 457mm x 610mm
Max : 457mm x 610mm
Board Thickness
0.6mm - 5.0mm
Copper Weight (Finished)
0.5oz - 2.0oz
Min Tracing/Spacing
3mil / 3mil
Solder Mask Color & Silkscreen Color
Same as Normal PCBs
Surface Finish
Min Drilling Hole Diameter
8mil
Impedance control
±10%
Other Techniques
HDI
Gold fingers
Stiffener (only for PI/FR4 substrate)
Gold fingers
Stiffener (only for PI/FR4 substrate)
Stack-Ups Structures and Design
Non-lamination rigid-flex board

Lamination rigid-flex board

Non-lamination rigid-flex board

Lamination rigid-flex board

Rigid-Flex CASE STUDY
4 Layers Rigid,1 Layer Flex PCB
4 Layers Rigid,2 Layers Flex PCB
6 Layers Rigid,4 Layers Flex PCB ,Immpedance Control
8 Layers Rigid,6 Layers Flex PCB
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