Industry-Leading Bare PCB Manufacturing Precision Engineering for Your Electronic Projects
At OurPCB, we deliver exceptional bare PCB manufacturing services with advanced capabilities, rigorous testing protocols, and industry-leading quality standards. Our state-of-the-art facilities in China manufacture high-quality bare printed circuit boards that combine cutting-edge technology with decades of fabrication expertise. Whether you need bare circuit boards for prototypes or production, our bare board PCB manufacturing meets the most demanding specifications for electronic projects across all industries.
Building on the legacy of PCB innovator Paul Eisler and manufacturing pioneers like John Parsons (CNC inventor) and Doug Ross (APT programming language developer), we position ourselves at the forefront of a growing global PCB market valued at $84.24B in 2023.
What are Bare PCBs, and
Why do they Matter?
Bare PCB boards are printed circuit boards without any electronic components, consisting of substrate material, conductive copper pathways, and protective coatings that form the foundation of all electronic devices. These essential bare boards direct electrical current through precisely designed pathways while providing mechanical support for the assembly process. The quality of bare PCBs directly determines the reliability, performance, and longevity of finished electronic products.
Our bare circuit board manufacturing process incorporates stringent quality controls at every stage, from initial design verification through final inspection, ensuring PCBs that meet exact specifications. We utilize advanced materials including high-temperature FR-4, Rogers, and specialized ceramics to support applications ranging from consumer electronics to medical devices and aerospace systems.
PCB Manufacturing Process
What Benefits do Our Bare PCB Manufacturing Services Provide?
Our bare PCB board manufacturing delivers exceptional value through precision engineering, comprehensive testing, advanced materials, and manufacturing expertise. As a leading bare PCB manufacturer, these benefits translate directly to improved product performance, reliability, and speed to market for your electronic projects.
- Our Flying Probe testing method verifies every electrical connection in the bare circuit board, eliminating hidden defects that could cause field failures.
- Advanced Automated Optical Inspection (AOI) with <0.01 mm measurement accuracy ensures perfect physical compliance with PCB design specifications.
- Streamlined DFM analysis reduces revision cycles by identifying and resolving potential manufacturing issues before we fabricate your PCB prototype.
- Expedited PCB fabrication options with maintained quality standards support critical new product launch timelines with quick turnaround.
- 48-layer manufacturing capability supports the most complex high-density PCB’s with rigid flex options.
- Advanced blind and buried via technologies enable sophisticated routing solutions in compact circuit form factors.
- Panellization expertise maximizes material utilization for bare PCB boards and reduces per-unit costs.
- Strategic material selection balances performance requirements with spec considerations for your printed circuit board manufacturing needs.
Why Choose OurPCB for Bare PCB Manufacturing?
OurPCB has been a top bare circuit board manufacturer since 1986, delivering superior bare board fabrication through our combination of advanced technology, rigorous quality systems, exceptional technical expertise, and comprehensive service offerings. As bare PCB suppliers, we focus on every detail to ensure perfect performance in your application. In a market projected to grow at 3% CAGR through 2030, we maintain competitive advantage through innovation and quality that exceeds the industry average first-pass yield of 92%.
- ISO certification and UL approval ensure adherence to the strictest quality management standards.
- RoHS compliant manufacturing guarantees boards meet environmental and regulatory requirements for top-quality electronics.
- Our comprehensive electrical testing identifies defects with 99.9% accuracy using flying probe technology.
- Electronic testing verifies signal integrity for high-speed designs with ±10% tolerance for the highest quality results.
- Our designers and engineers provide application-specific material recommendations based on thermal, electrical, and mechanical requirements.
- Specialized high-frequency materials enable superior RF performance for wireless applications in your bare PCB boards.
- Our engineering team provides pre-production DFM checks to optimize designs for manufacturability.
- Technical consultation throughout your PCB orders ensures optimal decisions for both through-hole technology and SMT applications.
- OurPCB uses premium equipment to manufacture insulated metal substrate PCBs
- Exceptional precision and consistency
- Every IMS board undergoes rigorous testing
- Automated optical inspection (AOI) and thermal analysis
- We design tailored solutions to meet unique project requirements
- OurPCB handles both multilayer and single-sided IMS boards
- Years of experience serving global industries
- OurPCB has a strong reputation as a trusted MCPCB manufacturer
PCB Assembly Services
OurPCB delivers an extensive suite of PCB assembly solutions, tailored to accommodate a variety of project requirements. We focus on delivering accuracy, efficiency, and stringent quality control throughout every stage of the assembly process.
We specialize in Surface Mount Technology (SMT) assembly, ideal for devices that demand compactness and high performance. Utilizing advanced pick-and-place equipment, we achieve highly accurate placement of components, ensuring reliable and consistent results.
We provide adaptable assembly models to suit your preferences. You may supply your own components for assembly, or choose our comprehensive turnkey service, where we manage component sourcing, assembly, and logistics from start to finish.
Our custom assembly services are designed to accommodate your specific designs, including intricate layouts and unique requirements. Our team collaborates closely with you to ensure all project specifications are fulfilled to your satisfaction.
We offer expedited PCB assembly services, delivering finished boards rapidly without compromising on quality. Even under tight timelines, we adhere to rigorous quality standards to ensure reliable performance.
We manufacture assemblies that comply with IPC Class 3 standards, which are essential for applications in sectors such as aerospace and medical devices. These assemblies are engineered for the highest levels of reliability in demanding environments.
Our capabilities extend to the precise assembly of all integrated circuit (IC) package types, including BGAs, POPs, CGAs, QFNs, DFNs, and CSPs. Our state-of-the-art equipment allows us to handle even the most complex IC packages with confidence and accuracy.
Millions of business and innovators use OurPCB
How does Our Bare PCB Manufacturing Process Ensure Quality?
OurPCB employs a meticulous eight-step bare PCB manufacturing process that integrates quality assurance at every stage. Our process begins with comprehensive design file analysis using advanced DFM tools that identify and resolve potential issues before production starts. This approach prevents downstream manufacturing problems and ensures higher first-pass yields for your bare copper board.
- Design file verification and BOM review
- Material selection and preparation
- Precision drilling systems for through-holes
- Copper plating and pattern imaging
- Etching and stripping
- Solder mask and silkscreen application
- Surface finish application (immersion gold, lead-free options)
- Comprehensive visual inspection and testing
What Materials do we use for Superior Bare PCB Performance?
Material selection critically impacts bare printed circuit performance, reliability, and application suitability. Our bare PCB factories offer an extensive range of substrate materials to meet specific project requirements, from standard FR-4 to specialized high-frequency laminates for multilayer PCBs.
| Material Type | Properties | Recommended Applications |
|---|---|---|
| FR-4 | Tg 130-140 °C, Good electrical properties | General electronics, Consumer devices |
| High-Tg FR-4 | Tg 170-180 °C, Enhanced thermal stability | Industrial controls, Automotive systems |
| Rogers | Low dielectric loss, Excellent RF performance | High-frequency applications, Microwave circuits |
| Polyimide | Extreme temperature resistance, Flexibility | Aerospace, Defense systems, Flexible circuits |
| Aluminum-backed | Enhanced thermal dissipation | Power electronics, LED lighting, Motor controls |
How do We Implement Advanced Impedance Control?
Impedance control is critical for high-speed digital and RF applications where signal integrity determines performance. As experienced bare PCB manufacturing suppliers, we implement precise impedance control through specialized material selection, careful stackup design, and manufacturing process controls. We achieve controlled impedance with ±10% tolerance across all board layers for circuit board prototypes and production runs.
Stackup Design Optimization
- Our impedance modeling software predicts electrical behavior before populating components.
- Material-specific dielectric constant variations are compensated through precise trace geometry adjustments.
Field Solver Technology
- Advanced electromagnetic field solvers calculate exact geometric requirements for target impedances.
- Differential pair routing receives special attention to maintain precise coupling characteristics for optimal reflow performance.
Verification Testing
- TDR (Time Domain Reflectometry) testing verifies actual impedance values match design specifications.
- Comprehensive test reports document impedance measurements across multiple board locations.
Documentation and Traceability
- Complete impedance control specifications are maintained throughout the bare PCB board factory process.
- Material lot tracking ensures consistency across production runs for turnkey projects.
What Testing Methods Verify Bare PCB Quality?
Our bare PCB manufacturing manufacturer status is built on comprehensive testing methodologies that verify both physical and electrical characteristics of every bare board. Our testing approach combines automated optical inspection with advanced electrical testing to ensure perfect compliance with design specifications for printed circuit board fabrication. We exceed standard IPC-6012 requirements by implementing IPC-A-600 Class 3 acceptance criteria, and our quality assurance laboratory maintains NIST-traceable calibration for all measurement equipment.
Advanced Electrical Testing Methods
- Flying probe testing verifies every connection on bare printed circuit board products against design parameters.
- Micro-sectioning analysis examines internal layer alignment and electrolytic plating quality.
- High-voltage isolation testing validates insulation integrity between circuits.
- Four-wire Kelvin testing measures low-resistance connections with high precision.
Our comprehensive testing protocol includes additional verification methods like X-ray inspection for multilayer registration and impedance testing using calibrated TDR systems that detect variations as small as 2%.
Technical Capabilities
OurPCB’s fabrication services deliver exceptional technical capabilities that surpass industry standards. Our advanced technology includes CNC drilling that achieves precise hole placement with ±0.001″ accuracy, while our laser drilling systems create microvias as small as 0.004″ for high-density interconnect applications.
| Capability | Specification | Advantage |
|---|---|---|
| Maximum Layers | From 2 layers up to 8-layer and beyond | Supports complex, high-density designs |
| Board Manufacturing | 0.2 mm to 7.0 mm thickness | Accommodates diverse application requirements |
| Minimum Trace/Space | 0.0762 mm/0.0762 mm (3mil/3mil) | Enables surface mount technology solutions |
| Standard PCBs | Multiple sizes available | Ideal for most electronic components |
| Maximum Aspect Ratio | 12:1 | Superior plating process for thick boards |
| Surface Finishes | HASL, ENIG, Immersion silver, OSP, Hard gold, Soft gold | Optimal solutions for different solder requirements |
Start Your Bare PCB Manufacturing Project Today
Contact us today to discuss your bare PCB manufacturing requirements and get a quote. Our technical experts will review your design specifications and recommend the optimal manufacturing approach for your project. With OurPCB as your bare printed circuit board supplier, you’ll receive precision-engineered products and services that provide the perfect foundation for your electronic products.
Request a quote online for your next PCB orders or call our technical sales team to begin your bare PCB manufacturing project with the best product for your needs.
- One-stop PCBA Services (PCB Manufacturing + Components Sourcing + Assembly)
- SMT Assembly + THT Assembly, Single/double-sided Assembly Mixed PCB Assembly
- BGA Rework
- 60,000 Chips/Hour
- Down to 01005/0210 Size
- Accuracy<±40μm
- Min. QFN Pin Width/Space: 0.15mm/0.25mm
- Min. BGA Diameter/Space: 0.2mm/0.35mm
- Rigid, Flex, HDI, & High-speed Power Boards
- Up to 50 Layers
- 60GHz High Frequencies
- Min. Trace Width/Spacing: 2.5mil/2.5mil
- AOI, X-ray, ICT & FCT Testing
- Controlled Impedance
- ISO 9001, ISO 13485, ISO 14001, IATF 16949, IPC-A-610, UL Certified
- Automotive, Medical, & Military-grade PCBA Manufacturing
Mon-Fri: 24 hours,
Sat: 9am-6pm, GMT+8
Reach us at
[email protected]
24 hours online
+86-199-30589219
Mon-Fri: 24 hours,
Sat: 9am-6pm, GMT+8
FAQs
What is the difference between HASL and ENIG surface finishes?
HASL (Hot Air Solder Leveling) applies molten solder to copper surfaces, providing good solderability at lower cost but with less planarity, while ENIG (Electroless Nickel Immersion Gold)deposits nickel and gold layers that offer excellent flatness for fine-pitch components and extended shelf life.
How do blind and buried vias differ from standard through-holes?
Blind vias connect an outer layer to one or more inner layers without extending through the entire board, while buried vias connect only internal layers without reaching the surface. These specialized via structures differ from standard through-holes by enabling higher routing density and improved signal integrity in complex multilayer designs, though they require more sophisticated manufacturing processes involving sequential lamination.
What factors affect bare PCB manufacturing turn time?
Bare printed circuit board turn time depends primarily on board complexity, layer count, and material availability, with each factor influencing production scheduling and processing time. High layer counts require multiple lamination cycles, special materials may have extended procurement times, and complex designs demand additional setup and testing procedures, though expedited fabrication services can accelerate delivery for time-critical projects.
