Your Expert BGA PCB Assembly Manufacturer

We can do plastic BGAs (PBGA), ceramic BGAs (CBGA), tape BGAs (TBGA), micro BGAs (μBGA), fine-pitch BGAs (FBGA), package-on-package (PoP) BGAs, and thermally enhanced BGAs for specialized applications.

We implement a comprehensive quality assurance process to check for voids in solder joints, bridging between balls, defects, misalignment, and incomplete reflow. The process includes precision equipment setup, controlled reflow profiles, X-RAY inspection for solder joint verification, and electrical testing to ensure reliable connections and optimal performance.

Yes, our facilities include specialized BGA rework stations operated by skilled technicians. We offer professional BGA replacement, reballing, and repair services for both prototype and production assemblies.

We can support BGA assembly on boards ranging from simple 2-layer to complex multilayer designs (12+ layers), accommodating various substrate materials and board densities according to your specific requirements.

We use advanced X-RAY inspection systems that allow non-destructive verification of BGA solder joints, including checking for proper alignment, solder ball formation, and the absence of voids or bridges to ensure reliable electrical connections.

Thermal profiling is the process of measuring and controlling the temperature of a PCB during solder reflow. It helps make sure the board reaches the correct temperatures at the right times to form strong, reliable solder joints without damaging components.

Start by choosing a suitable ball pitch—larger pitches like 1.0 mm are easier to route and inspect than fine-pitch BGAs. Use non-solder mask defined (NSMD) pads to improve solder joint quality and avoid open vias under pads unless they’re filled and capped to prevent solder wicking.

Maintain proper trace width and spacing based on your manufacturer’s design rules, and plan your layer stackup to allow clean escape routing—using microvias for high-density layouts. Keep solder mask alignment tight, apply the right paste volume, and leave space for test points or JTAG access since BGA joints can’t be visually inspected.

Our lead times vary from 4 days for simple 2-layer PCBs to 25+ days for large, multi-layer designs. Your specific project’s lead time will be based on the complexity of your BGA PCB design and the volume of your order.