Your Expert BGA PCB Assembly Manufacturer

iso
ISO 9001/UL Certified
icon assembly
PCB Assembly Specialists
icon truck
97% of PCB Shipped on Time
icon time
98% of PCB Delivered to Spec
icon guarantee
Delivery Guarantee

Experienced BGA PCB Assembly Manufacturer

PCB Manufacturing Process

online quote
Online Quote
upload pcb
Upload PCB File
order review
Order Review
payment
Payment
order update
Order Updates
truck
Delivery
confirm
Confirm Received

Our BGA PCB Assembly Capabilities

sp3
moon shape
wave w
Advanced Equipment
  • Precision pick and place machines 
  • Specialized BGA rework stations
Quality Verification
  • X-RAY inspection technology 
  • Automated Optical Inspection (AOI)
Technical Expertise
  • ISO 9001, IATF 16949, and IPC-A-610 Class 2 & 3 certified 
  • Advanced soldering techniques
Comprehensive Testing
  • Electrical continuity verification 
  • Functional performance testing

Why Choose OurPCB?

  • ISO 9001, IATF 16949, and IPC-A-610 Class 2 & 3 certified PCB assembly BGA factories
  • X-RAY inspection systems for non-destructive verification 
  • Specialized equipment including advanced BGA rework stations
  • Comprehensive quality control throughout the assembly process
sp1
sp2
sp3
ims img4
sp3
moon shape
wave w

Our BGA PCB Assembly Services

Millions of business and innovators use OurPCB

PCB Board Process

Design (1 day)

  • Upload Schematic to Get a Quote
  • PCB Review and Quotation
  • Customer Makes Payment
  • Evaluation & Confirmation of Plan
  • Design Start

Layout (1 day)

  • Layer Stack-up Design
  • Design Rule Setting
  • Component Placement Design
  • Confirmation & Optimization
  • Fanout

Routing (1 day)

  • Fanout Optimization
  • PCB Routing
  • Equal-length Adjustment
  • Routing Optimization
  • DRC Check
  • Routing Confirmation

Optimization (1 day)

  • Silkscreen Adjustment
  • Data Output
  • Customer Final Confirmation
  • Production Debugging
  • Archiving Projects
  • Finish

PCB Board Process

Order Received

  • Component Procurement
  • Preparation
  • PCB Manufacture
  • Make Process Flow

Soldering

  • Solder Printing/Wave Soldering
  • SMT/Plugging
  • Inspection (repair if necessary)
  • AOI (repair if necessary)
  • Transfer

Parts Assembly

  • Manual Assembly
  • PCBCleaning
  • Wire Screw
  • Inspection
  • Repair If Necessary

Finalization

  • Final Confirmation
  • Packing
  • Shipping

Our Technical Capabilities

wave w
mcd
sp3

Our Capabilities & Services

BGA PCB Assembly Manufacturer FAQs

What types of BGAs can you handle?

We can do plastic BGAs (PBGA), ceramic BGAs (CBGA), tape BGAs (TBGA), micro BGAs (μBGA), fine-pitch BGAs (FBGA), package-on-package (PoP) BGAs, and thermally enhanced BGAs for specialized applications.

How do you ensure quality in BGA assembly?

We implement a comprehensive quality assurance process to check for voids in solder joints, bridging between balls, defects, misalignment, and incomplete reflow. The process includes precision equipment setup, controlled reflow profiles, X-RAY inspection for solder joint verification, and electrical testing to ensure reliable connections and optimal performance.

Can you provide BGA rework services?

Yes, our facilities include specialized BGA rework stations operated by skilled technicians. We offer professional BGA replacement, reballing, and repair services for both prototype and production assemblies.

What board complexities can you support for BGA assembly?

We can support BGA assembly on boards ranging from simple 2-layer to complex multilayer designs (12+ layers), accommodating various substrate materials and board densities according to your specific requirements.

How do you verify BGA solder connections?

We use advanced X-RAY inspection systems that allow non-destructive verification of BGA solder joints, including checking for proper alignment, solder ball formation, and the absence of voids or bridges to ensure reliable electrical connections.

What is thermal profiling?

Thermal profiling is the process of measuring and controlling the temperature of a PCB during solder reflow. It helps make sure the board reaches the correct temperatures at the right times to form strong, reliable solder joints without damaging components.

How to design BGA PCBs for manufacturability?

Start by choosing a suitable ball pitch—larger pitches like 1.0 mm are easier to route and inspect than fine-pitch BGAs. Use non-solder mask defined (NSMD) pads to improve solder joint quality and avoid open vias under pads unless they’re filled and capped to prevent solder wicking.

Maintain proper trace width and spacing based on your manufacturer’s design rules, and plan your layer stackup to allow clean escape routing—using microvias for high-density layouts. Keep solder mask alignment tight, apply the right paste volume, and leave space for test points or JTAG access since BGA joints can’t be visually inspected.

What are your lead times for BGA PCBs?

Our lead times vary from 4 days for simple 2-layer PCBs to 25+ days for large, multi-layer designs. Your specific project’s lead time will be based on the complexity of your BGA PCB design and the volume of your order.