Abstract

In manufacturing P.C.B one crucial step is to make via hole on P.C.B. They are for placing the required components in the double side and multilayer P.C.B. There are two types of the hole on P.C.B. They are different from each other in size and their job nature.

Content

1. Two Types Of The Hole

2.Three Types Of Via Holes

 

1. Two Types Of The Hole

  • Large hole

According to the requirement of the circuit for P.C.B, these kinds of holes on P.C.B used to install different electronics equipment. Like Diode, Capacitor, Transistor, Resistor and so on.

  • Via holes (small hole)

A small pad hole’s which is used to combine the different track path in the double side or multilayer P.C.B is called via holes. They are not meant for holding components. Electrical current flow from these via hole from one side layer of P.C.B to other sides of PCB. Due to this procedure, less place (space) is used on P.C.B for wiring and component interconnection routing. After drilling the holes, via hole go through the electroplating process. One other method that

Via hole

2. There are three types of via holes are used in P.C.B manufacturing:

  • Plated through via holes

These types of via holes are commonly used in double-sided and multi-layer P.C.B. These via holes make through all layers of P.C.B. These via holes are visible on both outer surfaces of P.C.B. Due to this process current flow from outer one side to another side of P.C.B which covers all layers of a multi-layer P.C.B.

  • Blind via holes

These via holes connect the outer surface to the next or few near lawyers of P.C.B. In this process, a complete hole does not make through from all layers of P.C.B. Since they have the dead end in P.C.B that is why they are called blind via holes. These type of via holes are used to connect surface traces to inner layers of PCB.

  • Buried via hole

These via holes are also used in multi-layer P.C.B. These via holes connect inner layers of P.C.B. But they are not visible on outer surfaces of the P.C.B. Current flow between inner layers through these via holes.

 

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