Consignment PCB Assembly for Cost and Supply Chain Control

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ISO 9001/UL Certified
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PCB Assembly Specialists
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97% of PCB Shipped on Time
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98% of PCB Delivered to Spec
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Delivery Guarantee

PCB Manufacturing Process

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Online Quote
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Upload PCB File
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Order Review
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Payment
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Order Updates
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Delivery
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Confirm Received

Why Choose OurPCB for Consignment PCB Assembly?

Controlled Storage with ESD, MSL, and Lot-Level Logging

All customer-supplied parts are inspected at intake, stored in ESD-safe dry cabinets under <10% RH, and labeled by manufacturer part number, lot code, and quantity received.

Components sensitive to moisture follow JEDEC J-STD-033 bake-out and dry-pack protocols before surface mount placement.

Certified SMT Lines with Mixed-Mode Assembly Options

Our SMT platforms support 0201, BGA, µBGA, CSP, QFN, and lead pitch down to 0.3 mm, placed with ±25 µm accuracy and verified by SPI.

For hybrid builds, we use selective wave soldering and manual PTH insertion with nitrogen-assisted reflow for high I/O or double-sided placement.

Partial Consignment with BOM Reconciliation and Approved Vendor Sourcing

Clients may consign only proprietary or long-lead components. Remaining parts are sourced by OurPCB using a locked AVL and matched against your BOM, PNP, and gerber stack-up.

We conduct a first article inspection (FAI) and trace all sourced parts to authorized distribution.

X-Ray and AOI Inspection for Hidden Solder Joints

Assemblies using BGA, PoP, or bottom-terminated components are scanned with 5-axis X-ray (15 µm resolution) for voids, open joints, or head-in-pillow defects.

All boards also pass automated optical inspection (AOI) with 12 to 15 µm optical resolution for lead coplanarity, polarity, and placement accuracy.

Serial Tracking, MES Integration, and Traveler Documentation

Each consignment assembly is barcoded and tracked through an MES system that logs inspection status, operator ID, soldering parameters, and equipment data.

We provide clients with build-to-order travelers documenting every step from kit release to final quality assurance (FQA).

Post-Assembly Integration with Full Process Isolation

We offer downstream assembly services including firmware flashing, box build, cable harness connection, and functional test, all executed in isolated, ESD-controlled lines.

These services ensure that consigned printed circuit board assemblies are delivered as ready-for-deployment subassemblies or complete units.

How Our Consignment PCB Assembly Process Works

Kit Receipt and Verification Workflow

All consigned PCB kits are assigned a unique internal tracking ID at intake. Components are unpacked, sorted by feeder compatibility (tray, tube, tape), and checked against the BOM line-by-line.

Discrepancies in part number, reel labeling, or quantity shortfall trigger a hold and customer notification before any line setup is authorized.

Material Conditioning and Job Release Staging

Moisture-sensitive components are scanned for MSL classification and timeout. Floor-exposed parts are queued for bake-out and resealing before feeder prep.

Kits are then moved into a staging buffer with recorded timestamps, ready for scheduled job release into SMT or PTH lanes within a 24-hour window to avoid MSL re-exposure.

Feeder Setup and Placement Optimization

Feeder lanes are assigned based on component pick frequency, rotation offset, and machine head type (high-speed vs. multi-function).

Job setup includes vision system calibration, feeder load sequence, and nozzle selection to match the footprint.

For cut tape or partial reels, feeder splicing or leader creation with cover tape is performed in-line.

Final Inspection Sequencing and Routing

Boards flagged for BGA, PoP, or QFN automatically route to X-ray before post-reflow AOI.

Inspection sequence follows preassigned logic: X-ray → AOI → functional test, with exception routing for manual visual review if solder bridges or lifted leads are detected.

Final pass/fail disposition is recorded against the internal build traveler before packaging.

Assembly Execution and Process Sequencing

Once released to production, boards follow the programmed sequence of stencil printing, SMT placement, and thermal profile reflow based on solder type and component density.

For double-sided builds, bottom-side SMT is supported with low-tack adhesive or pallet fixturing. If mixed with PTH, boards are transferred to selective soldering or manual insertion before final reflow or wave pass.

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Our Consignment PCB Assembly Quality and Inspection Standards

our consignment pcb assembly quality and inspection standards
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Our Fine Pitch PCB Assembly Capabilities

OurPCB provides fine pitch PCB assembly services for advanced electronic systems requiring component pitches down to 8 mil. Every fine-pitch circuit board is evaluated against strict PCB fabrication tolerances, with DFM input provided before production to reduce defects and improve yield.

Minimum Supported Pitch and Placement Precision

We manufacture fine-pitch PCB assembly for components with center-to-center spacing as low as 0.3 mm (12 mil) and down to 8 mil for reviewed designs.

Our pick and place machines operate at ±25 µm placement tolerance with real-time optical correction, supporting the exacting alignment needed for fine-pitch parts like BGA, CSP, and chip-scale packages. Fiducials and board-level tooling holes are verified for every job to maintain positional accuracy during stencil registration and component placement.

Supported Fine-Pitch Components and High Pin Counts

We assemble fine-pitch ICs, package-on-package (PoP) devices, QFN, QFP, µBGA, and 0201 passives across multilayer printed circuit board designs.

Our systems accommodate thousands of electronic components per unit square area, with verified solderability on exposed pads, no-lead devices, and high pin count interconnects. For aluminum PCB and hybrid designs, our team analyzes thermal mass and planarity before first-run assembly.

Stencil Design and Solder Paste for Fine-Pitch Assembly

Our SMT assembly process uses laser-cut, electro-polished stainless steel stencils with aperture tolerances of ±10 µm. We select Type 4 or Type 5 solder paste based on aperture aspect ratio, stencil thickness, and pad geometry.

Paste is applied using squeegees with constant pressure control to prevent voids, bridging, or solder beading under fine-pitch components. Stencil thickness ranges from 100 µm for 0.5 mm pitch to 80 µm for 0.3 mm and below.

Controlled Reflow Soldering Profiles

We configure custom reflow soldering profiles using board-mounted thermocouples and zone profiling to manage wetting for dense fine-pitch PCB assembly. Nitrogen-assisted convection is used to reduce oxidation and improve joint formation, particularly for BGA PCB packages and dual-row QFNs.

Our thermal profiles maintain ramp rates under 3 °C/sec and peak reflow between 235 °C and 245 °C, minimizing warpage or tombstoning in high-density layouts.

PCB Fabrication Compatibility and Stackup Support

Our engineering team evaluates PCB fabrication and assembly readiness by validating trace widths, pad clearances, and PCB manufacturing capabilities against stackup tolerances.

Designs with via-in-pad, HDI PCB layers, or ultra-thin cores are reviewed for warpage risk, copper balance, and press cycle integrity. We also support impedance control and reference plane continuity essential for fine-pitch circuit routing.

Millions of business and innovators use OurPCB

PCB Board Process

Design (1 day)

  • Upload Schematic to Get a Quote
  • PCB Review and Quotation
  • Customer Makes Payment
  • Evaluation & Confirmation of Plan
  • Design Start

Layout (1 day)

  • Layer Stack-up Design
  • Design Rule Setting
  • Component Placement Design
  • Confirmation & Optimization
  • Fanout

Routing (1 day)

  • Fanout Optimization
  • PCB Routing
  • Equal-length Adjustment
  • Routing Optimization
  • DRC Check
  • Routing Confirmation

Optimization (1 day)

  • Silkscreen Adjustment
  • Data Output
  • Customer Final Confirmation
  • Production Debugging
  • Archiving Projects
  • Finish

PCB Board Process

Order Received

  • Component Procurement
  • Preparation
  • PCB Manufacture
  • Make Process Flow

Soldering

  • Solder Printing/Wave Soldering
  • SMT/Plugging
  • Inspection (repair if necessary)
  • AOI (repair if necessary)
  • Transfer

Parts Assembly

  • Manual Assembly
  • PCBCleaning
  • Wire Screw
  • Inspection
  • Repair If Necessary

Finalization

  • Final Confirmation
  • Packing
  • Shipping

Our Technical Capabilities

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Industries That Use Consignment PCB Assembly

Consignment PCB Assembly FAQs

What’s the difference between full and partial consignment PCB assembly?

In full consignment PCB assembly, you supply 100% of the materials, including PCBs, components, and documentation. In partial consignment, you provide critical or hard-to-source parts, while OurPCB handles component sourcing for the rest.

Both models are tracked under a single internal job ID with distinct traceability for each material origin.

What files do I need to submit for a consignment PCB assembly order?

We require a validated bill of materials (BOM), pick-and-place (PNP) file, Gerber files, and optional test specs or mechanical drawings.

BOMs must list part number, quantity, manufacturer, and footprint match. PNP files must define X/Y, rotation, polarity, and top/bottom layer. Gerbers must include copper, soldermask, paste, and silkscreen layers.

Can you use partial reels or cut tape in my consignment kit?

Yes, partial reels and cut tape under 150 mm must be pre-approved. OurPCB can splice, re-reel, or repackage components to make them compatible with automated feeders. Loose or bulk components must be bagged and labeled by MPN to avoid misload during feeder setup.

What happens if parts are missing or mismatched in my consigned kit?

We check every PBC consignment against the BOM and flag any quantity mismatch, expired shelf life, or part number error before line release. If your kit is incomplete, you can ship the missing items separately or authorize OurPCB to source the components under your approval.

Can you store unused inventory from my consignment kit for future builds?

Yes. Our warehouse offers secure, humidity-controlled inventory retention for surplus components linked to future production runs. You can reference the same job ID to trigger material reuse, saving time and eliminating reshipment for ongoing or revision-stable builds.

What happens if a consigned component fails inspection?

If a component in your PCB consignment arrives oxidized, mislabeled, expired, or visibly damaged, we place it in quarantine and report the issue before line release.

You may replace the part, request OurPCB to source an alternative, or authorize exclusion depending on the impact. No build proceeds without your written disposition for non-conforming items.

Can you update your BOM after submitting the consigned kit?

Yes, you may submit BOM updates or footprint changes after kit delivery, but any revision must be confirmed by OurPCB before feeder setup begins.

We version-control all consignment PCB assembly documentation, and new files are applied only if parts have not yet been programmed or loaded to feeders.

Do you accept customer-supplied PCBs as part of the consignment?

Yes, in full consignment PCB assembly, we can receive and assemble your bare boards alongside the components. Each panel is checked for soldermask integrity, surface finish, dimensional tolerance, and warpage before assembly.

Our lines support panel sizes up to 520 mm × 400 mm and board thicknesses from 0.6 mm to 3.2 mm.

What is the lead time for a consignment PCB assembly job?

OurPCB does not publish fixed lead times for consignment PCB assembly, as turnaround depends on part verification, stencil readiness, board complexity, and whether testing is required.

For most jobs, assembly is completed within 5 to 12 working days after kit approval. Longer lead times may apply to high-layer boards, partial kits, or orders requiring functional test or custom fixture integration.

Ready to Start Your Consignment PCB Assembly Project?