Comprehensive
Testing Solutions
for Assembled PCBs
OurPCB provides advanced PCB testing services for finished assemblies using precision-driven inspection platforms, ICT fixtures, and diagnostic instruments tailored for Class II and Class III PCBs.
Each PCB assembly testing service is executed under calibrated conditions using programmable digital power supplies, high-voltage testers, and automated inspection stations with traceable process control.
Testing coverage includes solder joint verification, functional logic testing, impedance measurement, and boundary scan analysis for BGA, QFN, and mixed-technology boards.
AOI systems detect pad voids down to 10 μm and X-ray platforms verify internal layer alignment and void percentages under 25%.
✅ AOI, flying probe, ICT, boundary scan, and high-voltage functional testing platforms.
✅ ISO 9001, IATF 16949, IPC-A-610 Class II & III certified with on-site engineers.
✅ Reports include pass/fail diagnostics, logged voltage/current data, and failure mode annotations.
PCB Manufacturing Process
Types of PCB Testing Services We Offer
OurPCB offers a full range of PCB testing services to detect assembly defects, confirm functionality, and meet IPC Class II and III inspection criteria. Each testing method targets a specific fault domain, including electrical, optical, mechanical, or software-related, and is applied using calibrated equipment and verified setups.
In-circuit testing uses a precision-machined bed of nails fixture with spring-loaded pins to access individual test pads and component leads on assembled PCBs.
The ICT system applies low-level stimulus signals and measures node voltages and currents to detect open circuits, shorts, incorrect values, and orientation errors.
OurPCB supports PCB assembly testing services using fixture-based ICT for Class II and Class III boards, with up to 2048 simultaneous test points and fault coverage over 90% for analog-digital hybrid assemblies.
PCB functional testing services apply full operating voltage and simulate real-world I/O, clock, and data protocols to verify complete circuit behavior.
Custom test fixtures interface with edge connectors, USB, CAN, I2C, SPI, or other device-specific ports to validate logic sequences, firmware response, and embedded software execution.
Our stations include programmable DC power supplies (0 to 30 V, 0.1% precision), signal generators, and relay control boards capable of cycling hundreds of channels.
Flying probe testing uses 4 to 8 independent needles mounted on multi-axis robotic arms to contact pads, vias, and test points on PCBs without requiring a fixture.
Each probe has a positional accuracy of ±5 µm, and contacts are sequenced dynamically based on a CAD-derived test script.
The system can measure resistance, detect opens/shorts, verify component orientation (via diode/LED polarity), and validate net isolation up to 500 V.
Our flying probe systems support double-sided access and adaptive Z-axis compensation, making them ideal for prototypes, small batches, and low-volume Class III assemblies with BGA or fine-pitch components.
Boundary scan testing uses JTAG-compliant integrated circuits with built-in test registers to shift test data across pins without physical probing.
OurPCB configures boundary scan chains to test for missing pull-ups, bus contention, stuck-at faults, and inter-device connectivity.
This technique is essential for PCB assembly testing services involving BGAs, QFNs, and CSPs, where solder joints are optically and mechanically inaccessible.
Using tools like XJTAG or Corelis, our engineers run structural tests and functional vector scripts that monitor internal register responses, enabling deep digital path validation on complex, high-speed designs.
Automated optical inspection (AOI) scans every board using high-resolution cameras (up to 25 µm/pixel) to detect missing parts, incorrect polarity, lifted leads, tombstoning, and solder bridging.
Our inline AOI systems support 3D height profiling and compare actual assemblies against a golden reference using rule-based or neural-net criteria.
For dense, multilayer boards, X-ray inspection (AXI) uses 5 µm focal spot tubes to capture internal layers and verify hidden joint integrity under BGAs, LGAs, and stacked packages.
Both AOI and AXI are performed as part of OurPCB’s integrated PCB testing and inspection services, supporting IPC-A-610 Class III conformance and continuous yield monitoring.
High-potential and insulation resistance testing are performed using programmable dielectric testers capable of applying voltages from 100 V to 1500 VDC across isolated nets.
We verify insulation resistance up to 1000 MΩ and dielectric breakdown levels across creepage gaps, especially in high-voltage power PCBs or where double-insulated barriers are required.
This PCB testing service is essential for validating the safety of industrial control boards, battery management systems, and EV power converters.
OurPCB configures custom test setups with adjustable ramp rates, dwell time, and arc detection to meet IEC 61010 and UL standards for Class II/III applications.
Why does PCB Testing Matter in Assembly?
PCB testing services verify electrical continuity, component functionality, and solder joint integrity after the board is assembled. Without complete testing coverage, latent faults such as open circuits, bridged pins, or misprogrammed ICs can escape detection during manufacturing.
Testing ensures that each unit meets IPC-A-610 Class II or Class III workmanship criteria. By combining functional testing, in-circuit testing, and visual inspection, manufacturers can reduce field failure rates, support DFM improvement loops, and maintain traceable quality benchmarks.
Our dual 10,000 m² PCB assembly houses in Shenzhen and Shijiazhuang are equipped with high-speed SMT assembly lines capable of placing fine-pitch parts with ±25 µm tolerance.
Each line includes temperature- and humidity-controlled environments, active anti-static systems, and vacuum transport for handling thin or flex printed circuits.
We are fully certified to ISO 9001, IATF 16949, and IPC-A-610 Class 2 & 3, supporting applications where fine-pitch PCB assembly must meet elevated acceptance criteria for solder joint geometry, lead coplanarity, and component body clearance.
Our QA workflows are built to handle fine-pitch PCBs requiring zero solder bridging and uniform joint fillets across dense arrays.
All assemblies involving ball pitch under 0.5 mm, QFN, or PoP packages undergo X-ray inspection, SPI, and AOI with 15 µm resolution optics.
We detect voids, open leads, insufficient solder, lifted terminations, and hidden shorts. This inspection process is a requirement for successful assembly when working with components that provide no visible solder access.
Every fine-pitch electronic assembly receives a DFM and DFA review focused on stencil coverage, aperture tuning, pcb design limitations, and routing near fine-pitch ICs.
We assist in verifying pad design, thermal pad exposure, and via escape planning, important for high I/O packages like BGA and chip scale layouts where misalignment or solder blockage can compromise yield.
We offer full assembly component sourcing through partners like Digi-Key, Mouser, and WPG, including traceable lots for hard-to-find or moisture-sensitive electronic components.
Components are stored under MSL-compliant conditions, with drying cabinets and vacuum packaging for all incoming fine-pitch parts.
Why Choose Our PCB Testing Services?
OurPCB combines in-house fixture development, multi-platform inspection systems, and Class III process conformance to deliver accurate and reliable results across industrial, medical, and automotive sectors. Each PCB assembly testing service is backed by traceable data, audit-ready reporting, and IPC-certified personnel.
OurPCB integrates PCB testing services directly into SMT, THT, and mixed-technology production lines.
AOI, ICT, and functional test platforms are embedded at key points across our two 10,000 m² facilities in Shenzhen and Shijiazhuang.
Boards pass through automated inspection and electrical test stages without manual handling, reducing contamination risk and improving test repeatability across Class II and III assemblies.
We build all ICT and functional test fixtures internally using CAD-based modeling, high-precision CNC drilling, and pogo-pin calibration systems.
Fixtures are validated for flatness, probe pressure uniformity, and node-to-net correlation before use.
This internal control allows us to shorten test development cycles for new PCB assembly testing services and maintain consistency across repeat orders or multi-site deployments.
Our test infrastructure includes high-speed AOI (25 µm resolution), 5 µm X-ray inspection, 4-wire flying probe testers, and digital high-voltage dielectric testers.
Resistance measurements down to 10 mΩ, voltage capture from 100 mV to 1500 VDC, and insulation resistance over 1000 MΩ ensure detailed diagnostics for every PCB testing service.
Measurement integrity is maintained through ISO-calibrated instruments and logged reference values.
We provide serialized test data with barcode traceability, linking each board to its BOM revision, test station ID, operator, and timestamp.
Reports include fail point coordinates, signal path diagnostics, image references (for AOI/AXI), and environmental test logs.
Our infrastructure supports full compliance with ISO 9001, IATF 16949, and medical-sector audit requirements, making our PCB functional testing services suitable for regulated deployments.
Our testing flows conform to IPC-A-610H Class III for high-reliability electronics, including burn-in testing, dielectric breakdown validation, and full visual and optical inspection of PCBs before final sign-off.
We support test plans that include ESS, startup sequence monitoring, and functional loop stress testing to simulate real-world deployment.
All solder joints, including BGA and QFN, are inspected using 3D AOI and void-mapped X-ray analysis.
Comprehensive quotes for PCB testing services and fixture-based setups are delivered within 48 working hours.
For new PCBA designs, we provide a DFT assessment, pin map verification, and component access review before test planning begins.
This early-stage input improves test coverage, minimizes false failures, and enables rapid onboarding for customers requiring PCB assembly testing services with complex or high-mix builds.
Our PCB Testing Capabilities Capabilities
Our PCB testing service is backed by precision-calibrated equipment, standardized test protocols, and compliance with IPC Class II and Class III performance limits. Our platform tolerances, electrical resolution, and optical inspection accuracy are engineered to meet the demands of production and prototype PCB assembly testing services across industrial, automotive, and regulated applications.
OurPCB performs PCB testing services on Class II and Class III assemblies, following IPC-A-610H acceptance criteria. These classes define inspection thresholds for solder joint quality, electrical verification, and fault tolerance, particularly in high-reliability sectors like medical and automotive electronics.
We validate assembly conformity across SMT, THT, BGA, and mixed-technology layouts using integrated inspection and electrical test platforms.
Our inspection and test systems operate at electrical resolution thresholds of 0.1 mV, 0.01 mA, and 10 mΩ resistance, with programmable tolerances for each node under test.
AOI vision systems validate component offset and skew with ±25 µm XY resolution, while flying probe systems apply net-to-net isolation testing up to 500 V with leakage current thresholds below 1 µA. Insulation resistance measurements exceed 1000 MΩ accuracy in dielectric and safety-critical zones.
Our test floor includes fixture-based ICT stations (1024 to 2048 pins), dual-head 3D AOI platforms, high-resolution X-ray inspection systems (5 µm focal spot), and multi-head flying probe testers with double-sided access.
Programmable digital power supplies (0 to 30 VDC, 0.1% accuracy), logic analyzers, and waveform generators are deployed in all PCB functional testing service lines. Each system is calibrated under ISO 9001 and traceable to NIST standards.
Voltage testing is performed from 100 mV to 1500 VDC, depending on the method: ICT, FCT, or high-voltage dielectric testing. Current measurements range from 10 µA to 10 A with 0.01 mA resolution, suitable for analog sensor loads and digital IC power rails.
For mechanical inspection, solder fillet height, lead coplanarity, and component tilt are captured with 3D AOI using 10 µm Z-axis repeatability.
All PCB testing services are conducted under ISO 9001, IATF 16949, and IPC-A-610 Class II/III certified workflows. Equipment undergoes scheduled calibration per GB/T19001-2016, and test procedures follow IPC-TM-650 and J-STD-003B for solderability, dielectric strength, and peeling resistance.
Testing data is logged, versioned, and stored in compliance with regulatory audit trail requirements.
Millions of business and innovators use OurPCB
Our EV Charger PCB Capabilities
EV charger designs require boards that balance electrical performance with thermal, mechanical, and compliance demands. Here’s how OurPCB meets those challenges through advanced fabrication, materials selection, and topology-specific design support.
Broad PCB Stack-Up and Layer Support
OurPCB fabricates EV charger (electric vehicle charger) PCBs from 2 to 32 layers, including rigid, flex, and rigid-flex stack-ups. Standard builds use FR4 or high-Tg FR4 (up to 180 °C Tg), with support for halogen-free, ceramic-filled, and polyimide substrates where thermal resistance or insulation integrity is required. Hybrid builds combining FR4 and PTFE or ceramic layers can be produced up to 16 layers with engineering review.
We support overall board thicknesses from 0.2 mm to 8.0 mm, with finished copper weights from 1/3 oz to 15 oz. Internal copper distribution is engineered to manage layer-specific current loads in AC or DC power sections, with stack-up validation provided for impedance matching and creepage (surface spacing between conductors to prevent arcing) compliance.e. Dielectric materials include ITEQ IT180A, Isola 370HR, and TUC TU-872 for high-voltage durability and low Dk stability across frequency.
High Precision Fabrication Parameters
OurPCB supports tight dimensional control and fine-feature fabrication for EV charger PCBs operating at high voltage and high current. Standard trace widths and spacing down to 0.05 mm (2 mil) are achievable with LDI exposure and precision etching, depending on copper weight and layer count. For inner layers, 3/3 mil design rules are supported on 35 µm copper; outer layers can reach 2.5/2.5 mil with 30 µm finished copper.
Minimum mechanical drill diameter is 0.15 mm, with aspect ratios up to 10:1 for plated through holes. Via-in-pad, back drilling, and controlled-depth milling are available for fine pitch designs and high-speed signal routing. Board outline tolerances are held to ±0.1 mm, with hole position accuracy to ±0.075 mm.
Standard thickness tolerance is ±10% for boards ≤1.0 mm and ±7% for boards between 1.8 mm and 4.0 mm. All fabrication steps are governed by IPC-6012 and IPC-2221 design standards for Class 2 and Class 3 performance targets.
Surface Finish Options for Harsh Environments
Standard finishes include lead-free HASL, OSP, ENIG, immersion silver, immersion tin, and hard gold plating. These options are selected based on end-use application, required contact durability, and environmental exposure.
ENIG (Electroless Nickel Immersion Gold), a corrosion-resistant nickel-gold surface finish, provides excellent planarity and corrosion resistance, making it ideal for connector pads and surface-mounted components in AC and DC charging modules. Immersion silver is available for high-speed signal layers requiring low contact resistance. Hard gold is used for edge connectors or gold fingers subjected to repeated mechanical wear.
All surface finishes are RoHS-compliant and applied in controlled chemical environments with line-level inspection for thickness, solderability, and uniformity. Selective finish combinations, such as ENIG with hard gold edge fingers or OSP over inner copper layers, are supported to meet mixed interface requirements in EV charging systems.
Full-Scope Assembly Services
OurPCB provides end-to-end assembly services for EV charger PCBs, supporting both surface mount and through-hole technologies. SMT lines handle fine-pitch components down to 0201 packages, with placement accuracy of ±25 µm and reflow profiles optimized for multilayer high-copper boards. Nitrogen reflow is available for oxidation-sensitive assemblies, especially in high-voltage applications.
We support THT processes for connectors, relays, and large passive components using wave soldering or selective soldering with controlled thermal gradients. Double-sided reflow, mixed technology, and BGA rework services are also available. BGAs are aligned using optical centering and inspected post-process with 5 µm resolution X-ray systems.
All assembly steps follow IPC-A-610 Class 2 or Class 3 criteria, with real-time process monitoring for solder paste volume, placement alignment, and joint integrity. ESD-safe material handling, moisture-sensitive device (MSD) tracking, and batch-level lot control are standard across both facilities.
Integrated Inspection and Test Systems
OurPCB integrates inline inspection and electrical test systems throughout the EV charger PCB assembly process to verify build quality, functional integrity, and regulatory compliance. Automated Optical Inspection (AOI) is used after solder paste printing and post-reflow to detect component skew, tombstoning, insufficient solder, and polarity errors across all SMT placements.
For assemblies with BGAs, QFNs, or embedded pads, real-time X-ray inspection validates solder joint formation and detects voids, bridging, or incomplete wetting. All BGA rework is re-inspected post-process. Solder paste inspection (SPI) verifies volume, height, and area coverage before pick-and-place.
In-circuit testing (ICT) is available for populated PCBs with accessible test points, using custom fixtures to measure continuity, resistance, diode orientation, and component presence. High-voltage testing and functional test rigs can be applied at end-of-line for charger boards operating in 220V or 380V systems. All tests follow IPC-TM-650 and customer-specific protocols for yield control and traceability.
Protective Coating and Environmental Sealing
OurPCB offers protective coating and environmental sealing solutions tailored to the outdoor and high-voltage demands of EV charger PCBs. Conformal coating, a protective film that shields against humidity, dust, and ionic contamination, is applied by selective spray, dip, or brushing methods using acrylic, silicone, or polyurethane chemistries. These coatings protect against humidity, condensation, dust, and ionic contamination, with thickness control between 25 µm and 75 µm.
We also provide three-proof treatment—moisture-proof, mold-proof, and salt-spray-proof—based on GB/T 4797.6-1995 standards. This process enhances board survivability in outdoor-rated chargers subject to IP54 or IP65 enclosures. Materials are qualified for adhesion, dielectric strength, and thermal cycling resistance.
All coated boards are UV-inspected for coverage uniformity and undergo post-cure verification before final packaging. Optional masking is available for connectors, test points, or edge fingers to maintain electrical interface integrity during the coating process.
Support for AC, DC, and Hybrid Charging Topologies
OurPCB manufactures EV charger PCBs designed for AC, DC, and AC/DC integrated systems, supporting charger power levels from 3.3 kW up to 30 kW. We fabricate control and power conversion boards for AC Level 1 and Level 2 chargers, DC fast chargers, and bidirectional onboard modules. Each topology requires specific copper distribution, insulation spacing, and thermal design strategies incorporated at the stack-up and layout levels.
For AC designs, we support isolated control PCBs with precise routing for zero-crossing detection, relay actuation, and grid interface circuitry. DC charger PCBs are built for direct high-current transfer, with wide trace widths, heavy copper layers, and reinforced dielectric spacing to meet safety class clearance requirements.
We also support charger architectures using SiC MOSFETs, GaN FETs, and phase-shifted full bridge (PSFB), LLC, or dual active bridge (DAB) converter topologies. Our production team can adapt layer counts, thermal relief, and pad geometry to support each topology’s electrical and mechanical demands.
Class III and High-Reliability Testing
Class III testing protocols are applied to automotive electronics, implantable and diagnostic medical devices, aerospace controls, and industrial safety systems with narrow fault tolerances and redundant circuit design.
All PCB testing services in this class follow IPC-A-610H Class III inspection standards and leverage elevated inspection thresholds, including 100% AOI coverage, post-reflow X-ray validation, and ICT with 95% minimum fault coverage.
Functional tests include thermal cycling simulations, startup-sequence monitoring, and analog signal stability under full operating load. Solder joint evaluation includes BGA voiding analysis (below 25% max area) and coplanarity verification to ±50 μm on all perimeter components.
Assemblies are electrically validated using high-accuracy power supplies, 4-wire resistance probes, and embedded sensor simulation modules that replicate actual use conditions. Environmental stress screening (ESS), burn-in testing, and optional conformal coating evaluation are included in high-reliability testing packages to qualify boards for long-term deployment in regulated sectors.
Data Logging, Traceability & Reporting
Every PCB testing service performed by OurPCB is logged with time-stamped records, fixture IDs, and unique board serial numbers for traceability across production lots. We integrate barcode scanning and digital record systems to track individual assemblies through each testing process, from in-circuit verification to final functional testing.
Electrical and inspection data are output in structured formats, including CSV, XML, and proprietary report templates compatible with MES and ERP platforms. Logged values include measured voltages, pass/fail status, detected fault types, and operator annotations. AOI and X-ray inspection systems capture and archive image files linked to serial numbers, enabling post-process review and historical analysis.
Each test result is indexed to the board’s BOM revision, date code, and routing lot, allowing for full backward traceability during quality audits or field failure investigations. Our traceability infrastructure meets the documentation and retention requirements for ISO 9001, IATF 16949, and IPC Class III PCB assembly testing services, supporting consistent product quality and regulatory readiness.
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PCB Testing Services FAQs
What’s the Difference Between Bare Board and Finished Assembly Testing?
Bare board PCB testing services verify the electrical integrity of copper traces and vias before any components are mounted. This involves continuity and isolation checks using flying probe or fixture-based setups to confirm that the PCB design matches the netlist and that no shorts or opens exist.
In contrast, PCB assembly testing services inspect and electrically validate the final assembled product, including functional testing, solder joint inspection, component orientation, and logic behavior under simulated operating conditions. Both test stages are essential to ensure the quality of the PCB from fabrication through deployment.
How do you Ensure PCB Testing Accuracy Across High-Mix Production?
We maintain testing accuracy using calibrated measurement instruments, automated optical and electrical platforms, and test scripting tied directly to BOM revision and Gerber data.
Fixture-to-board alignment is verified to ±0.1 mm, and voltage/current measurements use 0.1% tolerance digital supplies. For high-mix PCB testing services, we assign unique test profiles and lot traceability, ensuring repeatable outcomes across different assemblies and test setups.
What Types Of Defects can your PCB Testing Services Detect?
Our PCB testing services detect electrical faults such as opens, shorts, reverse-polarity components, and missing parts through ICT and flying probe methods. We also identify solder defects like tombstoning, cold joints, and insufficient wetting using 3D AOI and x-ray inspection.
Functional errors such as firmware failures, incorrect sensor output, or signal bus conflicts are captured during end-to-end functional test sequences.
Ready to Validate Your PCB Assembly
With Reliable PCB Testing Services?
Request a quote and get a custom testing plan tailored to your design, BOM, and inspection needs. We provide PCB testing services with full traceability, calibrated measurement systems, and certified workflows for Class II and Class III assemblies.
