Professional PCB Component Assembly Services

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ISO 9001/UL Certified
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PCB Assembly Specialists
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97% of PCB Shipped on Time
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98% of PCB Delivered to Spec
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Delivery Guarantee

What is PCB Component Assembly?

PCB Manufacturing Process

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Online Quote
upload pcb
Upload PCB File
order review
Order Review
payment
Payment
order update
Order Updates
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Delivery
confirm
Confirm Received

How does Our PCB Assembly Process Work?

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  1. Design Verification & DFA Review: We begin by analyzing your PCB design files and BOM to identify potential PCB assembly component spacing issues before production starts
  1. Component Procurement: Source components based on your specifications, making us a complete PCB assembly rotation component supplier
  1. SMT & THT Assembly: Precision placement of components using advanced pick and place machines and controlled soldering processes
  1. Multi-Stage Inspection: Rigorous quality verification using AOI, X-ray, and functional testing
  1. Final Quality Control: Complete verification against IPC standards before packaging and shipping

What are the Benefits of Our PCB Assembly Services?

Exceptional Quality Assurance
  • Our 3D Automated Optical Inspection (AOI) examines solder joints from multiple angles for complete defect detection
  • X-ray inspection systems verify hidden connections like BGA solder joints with 99.9% reliability
Reduced Time-to-Market
  • Prototype assembly turnaround as fast as 48 hours for urgent projects
  • Parallel processing capabilities for simultaneous handling of multiple board types
Optimized Production Costs
  • Component procurement optimization reduces parts costs by up to 15%
  • First-pass yields exceeding 99.5% minimize costly rework and waste
Advanced Technical Capabilities
  • Fine-pitch component placement down to 0.3 mm pitch BGAs and small components like 01005 passives
  • Conformal coating application for environmental protection in harsh operating environments
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Why Choose OurPCB for Component Assembly?

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PCB Assembly Services

OurPCB offers a comprehensive range of PCB assembly services designed to meet a wide variety of project requirements. We emphasize accuracy, efficiency, and robust quality assurance in every assembly we deliver.

Millions of business and innovators use OurPCB

PCB Board Process

Design (1 day)

  • Upload Schematic to Get a Quote
  • PCB Review and Quotation
  • Customer Makes Payment
  • Evaluation & Confirmation of Plan
  • Design Start

Layout (1 day)

  • Layer Stack-up Design
  • Design Rule Setting
  • Component Placement Design
  • Confirmation & Optimization
  • Fanout

Routing (1 day)

  • Fanout Optimization
  • PCB Routing
  • Equal-length Adjustment
  • Routing Optimization
  • DRC Check
  • Routing Confirmation

Optimization (1 day)

  • Silkscreen Adjustment
  • Data Output
  • Customer Final Confirmation
  • Production Debugging
  • Archiving Projects
  • Finish

PCB Board Process

Order Received

  • Component Procurement
  • Preparation
  • PCB Manufacture
  • Make Process Flow

Soldering

  • Solder Printing/Wave Soldering
  • SMT/Plugging
  • Inspection (repair if necessary)
  • AOI (repair if necessary)
  • Transfer

Parts Assembly

  • Manual Assembly
  • PCBCleaning
  • Wire Screw
  • Inspection
  • Repair If Necessary

Finalization

  • Final Confirmation
  • Packing
  • Shipping

Technical Capabilities

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FAQs

What is the difference between SMT and THT assembly?

Surface Mount Technology (SMT) involves placing components directly onto the surface of the PCB with solder paste and reflow soldering, allowing for higher component density and automated assembly. Through-Hole Technology (THT) involves inserting component leads through pre-drilled holes and soldering on the opposite side, creating stronger mechanical connections ideal for components subjected to mechanical stress.

How do you ensure manufacture and assembly reliability for high-temperature applications?

We implement specialized high-temperature assembly processes for applications operating in elevated temperature environments. This includes using high-temperature solder formulations with melting points above 280 °C, selecting components with appropriate temperature ratings, and applying thermal management techniques like strategic component placement and enhanced copper pour designs for effective heat dissipation.

What inspection methods do you use for BGA components?

We employ real-time X-ray inspection systems that examine hidden solder joints, identifying issues like voiding, bridging, or insufficient solder. This is complemented by thermal profile analysis during reflow and In-Circuit Testing (ICT) for electrical verification. For critical applications, we can also perform dye-and-pry tests on representative samples.