Flexible PCB Capability

Manufacturing Capability:Conventional Capability; Ultimate Capability:Unconventional ability;Submit to review beyond these Capabilities.

Category Project Item Normal Capability Ultimate Capability
FPC Base Material(Adhesive) ShengyiSF302:PI=0.5mil,1mil,2mil;Cu=0.5oz,1oz ShengyiSF305:PI=0.5mil,1mil,2mil;Cu=0.33oz,0.5oz,1oz /
Material FPC Base Material(Adhesiveless) SongxiaRF-775/777:PI=1mil,2mil,3mil;Cu=0.5oz,1oz Xinyang:PI=1mil,2mil;Cu=0.33oz,0.5oz,1oz Taihong PI=1mil,2mil;Cu=0.33oz,0.5oz,1oz Subang AP:PI=1mil,2mil,3mil,4mil;Cu=0.5oz,1oz PI=1mil,2mil,3mil;Cu=2oz PI=1mil,2mil,3mil,4mil;Cu=2oz
Layer 1-4 Layers 5-8 Layers
The thickness of Finished Product (Flex part,no stiffener) 0.05-0.5mm 0.5-0.8mm
Size of Finished Products(Min) 5mm*10mm(Bridgeless);10mm*10mm(Bridge) 4mm*8mm(Bridgeless);8mm*8mm(Bridge)
Size of Finished Products(Max) 9inch*14inch 9inch*23inch(PI≥1mil)
Others Impedance Tolerance Single-Ended:±5Ω(≤50Ω),±10%(>50Ω) Single-Ended:±3Ω(≤50Ω),±8%(>50Ω)
Impedance Tolerance Differencial:±5Ω(≤50Ω),±10%(>50Ω) Differencial:±4Ω(≤50Ω),±8%(>50Ω)
Tolerance of Finger Width ±0.1mm ±0.05mm
Min Distance to the Edge of Finger 8mil 6mil
Min Distance between Pads 4mil 3mil
Minimum Laser Hole 0.1mm /
Mechanical Minimum PTH 0.3mm /
Min NPTH Tolerance ±2mil(Ultimate+0,-2mil or +2mil,-0) /
Solder Bridge Min Width(bottom copper<2OZ) 4mil(Green),8mil /
Solder Mask Solder Bridge Min Width(bottom copper2-4OZ) 6mil,8mil /
Overlay Colour White、Yellow(printed character: White) /
Surface Treatment Type of Surface Treatment Selective Surface Treatment OSP   HASL, Lead-free HASL, Immersion gold, Hard gold, Immersion silver, OSP ENIG+OSP,ENIG+G/F /