| Category |
Project Item |
Normal Capability |
Ultimate Capability |
|
FPC Base Material（Adhesive） |
ShengyiSF302：PI=0.5mil，1mil，2mil；Cu=0.5oz，1oz
ShengyiSF305：PI=0.5mil，1mil，2mil；Cu=0.33oz，0.5oz，1oz |
/ |
| Material |
FPC Base Material（Adhesiveless） |
SongxiaRF-775/777：PI=1mil，2mil，3mil；Cu=0.5oz，1oz
Xinyang：PI=1mil，2mil；Cu=0.33oz，0.5oz，1oz
Taihong PI=1mil，2mil；Cu=0.33oz，0.5oz，1oz
Subang AP：PI=1mil，2mil，3mil，4mil；Cu=0.5oz，1oz |
PI=1mil，2mil，3mil；Cu=2oz
PI=1mil，2mil，3mil，4mil；Cu=2oz |
|
Layer |
1-4 Layers |
5-8 Layers |
|
The thickness of Finished Product （Flex part，no stiffener） |
0.05-0.5mm |
0.5-0.8mm |
|
Size of Finished Products（Min） |
5mm*10mm（Bridgeless）；10mm*10mm（Bridge） |
4mm*8mm（Bridgeless）；8mm*8mm（Bridge） |
|
Size of Finished Products（Max） |
9inch*14inch |
9inch*23inch（PI≥1mil） |
| Others |
Impedance Tolerance |
Single-Ended：±5Ω(≤50Ω),±10%(＞50Ω) |
Single-Ended：±3Ω(≤50Ω)，±8%(＞50Ω) |
|
Impedance Tolerance |
Differencial：±5Ω(≤50Ω),±10%(＞50Ω) |
Differencial：±4Ω(≤50Ω)，±8%(＞50Ω) |
|
Tolerance of Finger Width |
±0.1mm |
±0.05mm |
|
Min Distance to the Edge of Finger |
8mil |
6mil |
|
Min Distance between Pads |
4mil |
3mil |
|
Minimum Laser Hole |
0.1mm |
/ |
| Mechanical |
Minimum PTH |
0.3mm |
/ |
|
Min NPTH Tolerance |
±2mil(Ultimate+0，-2mil or +2mil，-0) |
/ |
|
Solder Bridge Min Width(bottom copper＜2OZ) |
4mil(Green)，8mil |
/ |
| Solder Mask |
Solder Bridge Min Width(bottom copper2-4OZ) |
6mil，8mil |
/ |
|
Overlay Colour |
White、Yellow（printed character: White） |
/ |
| Surface Treatment |
Type of Surface Treatment
Selective Surface Treatment |
OSP HASL, Lead-free HASL, Immersion gold, Hard gold, Immersion silver, OSP
ENIG+OSP，ENIG+G/F |
/ |
