Mid Volume PCB Assembly Manufacturer for Reliable Production Runs

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ISO 9001/UL Certified
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PCB Assembly Specialists
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97% of PCB Shipped on Time
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98% of PCB Delivered to Spec
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Delivery Guarantee

What is Mid Volume PCB Assembly?

PCB Manufacturing Process

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Online Quote
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Mid Volume PCB Assembly Manufacturer Delivering End-to-End Production Expertise

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What are Our Mid Volume PCB Assembly Capabilities?

High-Speed SMT Assembly Lines

OurPCB operates fully automated SMT assembly lines capable of placement accuracy within ±40μm, using high-speed pick and place machines, precision solder paste printers, and SPI systems that inspect paste volume, height, and alignment.

Supported by nitrogen reflow ovens and inline AOI verification, this capability ensures reliable mounting even for 0.2 mm pitch BGAs and 0201-sized passive components, necessary for sectors like medical instrumentation where miniaturization and reliability are non-negotiable.

Precision Through-Hole Assembly

Dedicated through-hole assembly stations integrate automated insertion and selective soldering processes with manual quality reinforcement for mechanically sensitive components.

Our selective soldering systems apply controlled molten solder precisely at thermal profiles optimized for connectors and high-current components, often used in automotive sensor PCB assemblies requiring rugged mechanical stability.

Advanced BGA Assembly and X-ray Inspection

Our BGA assembly lines feature real-time X-ray inspection systems capable of identifying voids smaller than 25% of the pad area, bridging faults, and collapsed ball formations. For industries like industrial control and communications, this ensures robust hidden interconnects where traditional surface inspection methods cannot reach.

BGA rework stations with micro-alignment optics support high-quality repairability when necessary, extending board yield rates beyond 98% even on complex multilayer designs.

Comprehensive AOI and Functional Testing

Inline automatic optical inspection (AOI) captures high-resolution 2D and 3D imagery to detect missing components, tombstoning, skew, and insufficient solder joints with a detection accuracy exceeding 95%.

Post-assembly functional testing verifies power integrity, I/O response, and operational logic, helping clients in critical fields like medical monitoring and telecommunications validate every board before final shipment.

Full BOM Sourcing and Hard-to-Find Components

OurPCB handles full BOM sourcing through authorized distributors, ensuring traceability down to date and lot codes for critical parts. For hard-to-find electronic components or end-of-life risks, our sourcing teams propose form-fit-function alternatives with full client approval workflows, maintaining compliance with IPC standards and safeguarding continuity in low-mid volume production and scaling phases.

Custom Fixtures and Dedicated Testing Solutions

Custom ICT and functional test fixtures are designed in-house to match specific board layouts, providing up to 500 test points for comprehensive validation. Fixture-guided testing reduces operator variability, improves first-pass yield rates by up to 10%, and accelerates fault isolation, a sizable advantage when scaling from prototype quantities into sustained mid volume PCB assembly runs.

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How does OurPCB Handle Mid Volume Production Runs?

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What does the Mid Volume PCB Assembly Process Include?

Millions of business and innovators use OurPCB

PCB Board Process

Design (1 day)

  • Upload Schematic to Get a Quote
  • PCB Review and Quotation
  • Customer Makes Payment
  • Evaluation & Confirmation of Plan
  • Design Start

Layout (1 day)

  • Layer Stack-up Design
  • Design Rule Setting
  • Component Placement Design
  • Confirmation & Optimization
  • Fanout

Routing (1 day)

  • Fanout Optimization
  • PCB Routing
  • Equal-length Adjustment
  • Routing Optimization
  • DRC Check
  • Routing Confirmation

Optimization (1 day)

  • Silkscreen Adjustment
  • Data Output
  • Customer Final Confirmation
  • Production Debugging
  • Archiving Projects
  • Finish

Mid Volume PCB Testing and Inspection Process

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SPI Solder Paste Inspection

Solder paste deposits are checked using SPI systems that measure height, volume, and pad coverage before placement begins.

OurPCB maintains ±10% tolerance thresholds on solder volume to prevent defects like head-in-pillow and insufficient wetting during reflow.

Early-stage inspection ensures that only boards meeting print quality standards continue through the assembly process.

Automatic Optical Inspection (AOI)

After reflow, automatic optical inspection scans each board to detect missing parts, polarity errors, tombstoning, skew, and solder bridging.

OurPCB uses both 2D and 3D AOI, allowing volumetric analysis of solder fillets and component seating alongside surface visual checks.

Inspection data feeds directly into production traceability records for real-time yield monitoring.

X-Ray Inspection for BGA and Hidden Joints

BGA, CSP, and QFN components are validated through x-ray inspection to uncover hidden defects.

OurPCB’s systems can detect voids occupying over 25% of a pad, collapsed balls, and bridging beneath large packages.

This process meets IPC-A-610 Class 2 and Class 3 acceptance criteria, supporting industries like medical and industrial control, where connection reliability is highly important.

Functional Testing and In-Circuit Testing (ICT)

Functional testing and in-circuit testing (ICT) validate the operational behavior and electrical connectivity of completed boards.

Custom test fixtures allow verification of power rails, I/O lines, clock stability, and analog signals under simulated load conditions.

ICT checks shorts, opens, incorrect part placements, and component values down to resistor tolerance levels, improving first-pass yields.

Statistical Process Control and Final Verification

SPC techniques are applied across paste deposition, placement accuracy, reflow profiling, and inspection results to track performance trends. Units passing final optical checks undergo microscope-based verification, confirming cosmetic quality against IPC visual standards. Full traceability of assembly data supports quality reporting for sectors requiring regulatory compliance.

Why Choose OurPCB as Your Mid Volume PCB Assembly Manufacturer?

Mid Volume PCB Assembly Manufacturer FAQs

What PCB sizes, and layer counts can you handle for mid-volume production?

We manufacture PCB assemblies ranging from 50 mm x 50 mm modules to panels up to 610 mm x 508 mm, supporting 1 to 50-layer stack-ups. Controlled impedance, HDI structures, blind and buried vias, and mixed-material builds are available for mid-volume runs, meeting technical requirements across sectors like medical imaging, automotive sensors, and industrial automation.

Can you manage both SMT and through-hole components on the same board?

Yes, OurPCB configures hybrid SMT and through-hole assembly lines to support mixed-technology designs. Boards combining 0201 SMT parts, connectors, and power components up to 20A ratings are processed using selective soldering with nitrogen atmospheres, preventing thermal stress and improving mechanical stability for mission-critical applications.

How do you control solder quality during mid-volume production?

Solder paste deposition is verified with 3D SPI systems within ±10% volume tolerance, followed by real-time AOI and X-ray inspections after reflow. SPC techniques track variation trends, triggering process adjustments before defects propagate. These controls maintain first-pass yields above 98% across mid-volume production batches.

What types of PCB testing are available before shipment?

Every PCB assembly passes inline automatic optical inspection and receives functional testing with programmable fixtures simulating operational conditions. For boards with complex or hidden interconnections, in-circuit testing (ICT) and 3D X-ray verification are applied. Testing strategies are customized based on application criticality, regulatory needs, and expected operating environments.

Can you support PCB prototype assembly before scaling to mid-volume production?

Yes, OurPCB offers prototype PCB assembly services with the same certified processes used for full production. Early-stage builds benefit from DFM and DFT analysis, allowing clients to identify manufacturability or testability risks before ramping into low-mid volume production. Seamless scaling reduces project lead times and stabilizes quality performance across volumes.

Partner with OurPCB for Reliable Mid Volume PCB Assembly Manufacturer Services