With the rigorous and precise process in our factory, you know that your purchase will be of high quality.

Advanced Testing Technology To Ensure Quality such as AOI Test, E-Test, X-RAY, Impedance Control.

As a customer-centric company, we are committed to delivering the highest quality products and services at competitive prices (especially multilayers PCBs).

ABOUT HDI PCB

The HDI application is one of the fastest-growing technologies today. The acronym stands for High-Density Interconnect, which comes with several interconnection points enclosed within a small space that result in reduced circuit boards – though functionally not affected!

In other words, a PCB with about 120-160 pins per square inch is an HDI. So the design of the HDI integrates versatile routing and density component placement. This PCB type became popular because it made micro via technology famous – an ideal option for blind vias, micro vias, or buried vias.

THE 3 WAYS TO DESIGNING A SUCCESSFUL HDI PCB

There are three ways you can design HDI prototyping boards that will yield success every time.

And they are as follows:

1. Manufacturing Process

Before you begin your HDI PCB design, you first need to understand the HDI manufacturing process parameters. And to do that, you need to consider three factors:

Aperture Ratio

To have a successful HDI PCB, you must know the aperture ratio that is appropriate for your fabrication.

 

For the best results, keep your aperture size proportional to how thick or thin you want your board.

 

Stack

 

The stack-up of the HDI PCB has to get classified based on specific types. For instance, Non-stacked 2-HDI (with buried holes), Stacked and resin-filled 2-HDI, 1 stacked and nonresin filled2 -HDI with buried holes).

 

Process Flow

 

The process flow for the 4-layer and 6-layer HDI boards are very similar to standard PCBs, with one major difference: drilling holes sequencing.

 

2. Layout

 

When you use HDI PCB layouts in your projects, it’s important to be aware of the maintainability and stability.

 

3. Tracking

 

You must consider the tracking process, including the tracking’s consistency, the least line width, and regulating safe spacing.

HDI PCB CAPACITY (UP TO 32 LAYERS)

Feature
Capacity
Number of Layers :
1 - 32 layers
Time of Production:
1 day - 4 weeks
Quality Grade:
Standard IPC 2
Order Quantity:
1pc - 10000+pcs
Copper Weight (Finished):
6oz/10oz
Board Size:
Min 50*50mm | Max 450*406mm
Material:
FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination
Board Thickness:
0.2mm - 10mm
Silkscreen Color:
White, Black, Yellow
Solder Mask Color:
Green, Black, Blue,White, Red, Yellow
Min Tracing/Spacing:
2.5mil/2.5mil
Solder Mask Sides:
As per the file
Silkscreen Sides:
As per the file
Max Exponents of Blind/Buried Vias:
Stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
Min Annular Ring:
4mil, 3mil - laser drill
Other Methods:
Flex-rigid combination Via In Pad Buried Capacitor (only for Prototype PCB total area ≤1m²)
Surface Finish:
HASL- Hot Air Solder Leveling Lead Free HASL - RoHS ENIG - Electroless Nickel/Immersion Gold - RoHS Immersion Silver - RoHS Immersion Tin - RoHS OSP - Organic Solderability Preservatives - RoHS
Min Drilling Hole Diameter:
6mil, 4mil - laser drill

The Different Types of
HDI PCB Structures

We can produce up to 32 layers at a time. So you’ve got plenty of options depending on your specific needs! We created this table that breaks down all our HDI PCB structures for quick reference:

HDI PCB Structures The Various categories of Micros Vias Large-Scale Production Small to Medium-Scale Production Prototype Available
1+N+1 Blind vias Yes Yes Yes Over 4 layers
2+N+2 Blind/Buried staggered vias Yes Yes Yes Over 6 layers
2+N+2 Blind/Buried stacked vias Yes Yes Yes Over 6 layers
3+N+3 Blind/Buried stacked vias / Yes Yes Over 8 layers
3+N+3 Blind/Buried stacked vias / / Yes Over 8 layers
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WHAT IS THE FUTURE FOR HDI PCB?

HDI PCBs are creating a lot of possibilities in a wide range of industries. And it can only develop as time passes.

So, it’s a technology that you should consider—especially if you need something that will save you time and boost your efficiency. Plus, the demand for the HDI PCB increases regularly. So, we can tell that it’s promising.

Are you interested in getting more information about HDI PCB?

THE BENEFITS OF USING HDI PCB

Better Signal Veracity

  • HDI integrates with a blind via tech and via-in-pad to put PCB components together without cutting down the signal path length.
  • HDI also eliminates Via stubs, which limits signal reflection and boosts the quality of signals.

Affordable

  • An 8-layer PCB can reduce to a 6-layer PCB. By doing so, you'll still maintain an exceptional quality level and brightness in your product.

Compact Design

  • The grouping of micro, blind, and buried vias reduces the requirement for board space.

Better Signal Veracity

  • The integration of stacked vias makes HDI boards highly resistant to extreme environmental conditions because of the super shield.

Extraordinary Adaptability

  • The HDI board is a perfect solution for those looking to save space and weight while still maintaining excellent performance.

THE DIFFERENCE BETWEEN STANDARD AND HDI PCBs

The standard PCBs use through-holes, which means they have a high stray capacitance and a colossal discontinuity in impedance.

 

The HDI design employs buried vias and small blinds. These two factors significantly reduce stray inductances and capacitances, which in turn provides excellent signal integrity performance. In addition to that, other vital differences between the standard PCB versus the high-density board are:

Through-Hole PCB (Standard):
HDI PCB
It has a lower component density per square inch:
HDI has a higher component density per square inch compared to standard PCBs
Uses mechanical drilling:
HDI uses direct laser drilling
Standard PCBs have heavier and larger boards:
It has lighter and smaller boards with increased functionality
Comes with a high number of layers:
Features a low number of layers
Standard PCBs use through-holes:
HDIs use microvias, blind, and buried vias
When paired with low pitch packages, it faces a few compatibility problems:
packages, it faces a few compatibility problems:

APPLICATIONS OF THE HDI PCB

Automotive

  • Technology is having a large effect on the automotive industry. It has pushed engineers to work towards making cars more enjoyable for drivers and saving space in vehicles.

Health Care Sector

  • HDI PCBs have provided great possibilities for the medical field. For example, they play a large role in diagnosing diseases and are an excellent source of equipment for pacemakers such as those used to diagnose heart disease.

Aerospace and Military

  • The HDI PCBs can withstand extreme conditions, which can use in military and aerospace applications. defense systems and communication devices for troops on the field.

Industries

  • Your VR headset, tablet, smartwatch, laptop entertainment systems, smartphone, or home appliances. All these gadgets have an HDI

HDI PCB CASE STUDY

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