mSAP PCB: A Substrate-Bonded Additive Copper Layer Fabricated Circuit Board
With the rising demand to build smaller devices while packing more technology into them, there is a need to develop more compact PCBs. Currently, applications requiring small circuit boards rely on HDI (High-Density Interconnection) PCBs, but these are still not small enough. However, there is a solution. helps mSAP PCB miniaturize further, enabling them to […]
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