The two main properties of PCB base material are thermo-mechanical and electrical.

PCB Thermo-mechanical Properties of Base Material:

PCB Thermo-mechanical Properties:

Thermal expansion can be calculated by thermo-mechanical analysis (TMA). This method uses a device which measures dimension of temperature versus sample. The z-axis CTE or x/y CTE can be measured depending on the orientation of sample in device. CTE means Coefficient of Thermal Expansion.

Thermal expansion in the z-axis will considerably influence the reliability of printed circuits boards. Because plated through holes run through the z-axis of printed circuit, the contraction and thermal expansion in the base materials results in plastic and strain deformation in plated through holes and also deform copper pads on the surface of printed circuit.

PCB Thermo-mechanical Properties1

 

Decomposition Temperature:

The resin system will start to decompose as the material is started to heat up-to a particular temperature. The resin system chemical bonds will break up. Volatile components will fly away leaving behind the reduced mass of sample. The Td is the decomposition temperature at which the process occurs

 

 

 

PCB Thermo-mechanical Properties of Base Material:

PCB Thermo-mechanical Properties2

Time of De-lamination:

Time to de-lamination describes a particular test method used to measure how long a material will oppose de-lamination or blistering at a particular temperature. The method uses a thermo-mechanical analyzer (TMA) in it a sample is heated to the particular temperature. The common temperature is 260°C.This test is also called T260 test.

 

 

 Arc Resistance:

This test uses a technique in which a low current arc is placed on top of the surface of a material. Arc resistance defines the time a material resists tracking, or forming a conductive path, under this state.

 

PCB Thermo-mechanical Properties of Base Material:

Copper Peel Strength:

Peel strength is the measure of strength of the bond between the conductor and the substrate

PCB Thermo-mechanical Properties3

Flexural Strength:

It is the measure of the load that the base material will endure without fracturing when supported at the two ends and loaded in center

 

 

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