PCB Base Material Types- How To Determine The Type


The three main types of base material include

  • The Resin System
  • The Reinforcement
  • The conductor


1.Resin System

2.Tetra Functional Epoxy Resin

3.Epoxy Blends

4.Bismaleimide Triazine (BT)/Epoxy

5.Cyanate Ester


7.Polytetrafluoroethylene (PTFE,Teflon)

8.Polyphenylene Ether (PPE)


PCB Base Material Types:

Resin System:

The most common resin is the epoxy resin. There are further other types of epoxy resin. The epoxy resin is the most successful type used in PCB base material. It offers the mixture of good electrical, physical and mechanical properties. Low cost and comparatively easy to process

The epoxy resin is made by the reaction between epichlorohydrin and Bisphenol A. The resultant is di-functional epoxy resin

PCB Base Material Types1

Difunctional epoxies are used in comparatively unsophisticated boards such as simple double sided printed circuit boards. But on the other hand they are blended with other epoxies to work for high performance systems

PCB Base Material Types:

Tetra Functional Epoxy Resin:

Usage of epoxy compounds along with more than two epoxy-functional groups per molecule comes out to be in tetra functional epoxy resin or more multi functional epoxy resin. This in result will increase thermal and physical properties and higher levels of Tg. The common ranges of Tg are 145⁰C, 150⁰C, 165⁰C, 170⁰C up-to 190⁰C

Tg is the temperature at which, resin changes from a glassy or rigid state to softer more deformable state. Td is known as the decomposition temperature. This influence thermal reliability of PCB

PCB Base Material Types2


PCB Base Material Types:

Epoxy Blends:

They include epoxy polyphenylene oxide (PPO), epoxy cyanate ester and epoxy isocyanurate. These materials affect the productivity in multilayer lamination and drilling can require special treatment and special hole-wall taming processes that depends on fabrication process used and design of PCB

PCB Base Material Types3


PCB Base Material Types:

Bismaleimide Triazine (BT)/Epoxy:

BT epoxy usually used in BGA Ball Grid Array substrates and chip scale packages. This is because it can meet the requirements of specs to be used in semiconductor chip packaging

It is appropriate for high density multi-layers that require good chemical, electrical and thermal performance

They are brittle in nature and very costly.

Cyanate Ester:

Thermal stability is good. Tg is around 250⁰C and show very good electrical characteristics. They are highly expensive and need special processing that adds extra cost to the finished circuit. They are used in very selective niche applications


In applications where extreme heat resistance is required, we use polyimide resins. Circuits made with polyimide have very high levels of thermal reliability. Polyimide has Tg of 260⁰C. This high Tg will minimize thermal expansion.

Polytetrafluoroethylene (PTFE,Teflon)

A diversity of PTFE made products is available for applications in which very good electrical properties are required. They often require very specialized processing and are comparatively expensive

Polyphenylene Ether (PPE)

PPE based products gives greater electrical properties as well as the excellent thermal performance. This resin is greatly suitable for RF, wireless communication and high speed computation applications


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